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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
MPC860TCVR66D4- ND	MPC860TCVR66D4	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Not For New Designs Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (4), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC860	1000 Order	44+: $55.3692
MC9328MX1VH20-N D	MC9328MX1VH20	NXP USA Inc	View more Series: i.MX1 Packaging: Tray Part Status: Obsolete Core Processor: ARM920T Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touch Panel USB: USB 1.x (1) Voltage - I/O: 1.8V, 3.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 256-LFBGA Additional Interfaces: IC, IS, SPI, SSI, MMC/SD, UART Base Part Number: MC9328MX1	1000 Order	--
MPC870CZT133-ND	MPC870CZT133	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10/100 Mbps (2) USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 100C (TA) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: IC, PCMCIA, SPI, TDM, UART Base Part Number: MPC870	1000 Order	1+: $0
MC860DECZQ50D4R 2-ND	MC860DECZQ50D4R 2	NXP USA Inc	View more Series: MPC8xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (2) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MC860	1000 Order	1+: $0
568-9463-5-ND	TDF8530TH/N1,51 2	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Type: Class D Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 100W x 4 @ 2 Ohm Voltage - Supply: 6 V ~ 24 V Features: Depop, IC, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C (TA) Supplier Device Package: 44-HSOP Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad Base Part Number: TDF8530	1000 Order	1+: $0
MC9328MXLVP15-N D	MC9328MXLVP15	NXP USA Inc	View more Series: i.MXL Packaging: Tray Part Status: Not For New Designs Core Processor: ARM920T Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 150MHz RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD USB: USB 1.x (1) Voltage - I/O: 1.8V, 3.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 225-LFBGA Supplier Device Package: 225-MAPBGA (13x13) Additional Interfaces: IC, IS, SPI, SSI, MMC/SD, UART Base Part Number: MC9328MXL	1000 Order	800+: $7.1801
MPC850ZQ50BU-ND	MPC850ZQ50BU	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Not For New Designs Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA-ATA, TDM, UART/USART Base Part Number: MPC850	1000 Order	--
MPC860DTVR80D4- ND	MPC860DTVR80D4	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (2), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC860	1000 Order	1+: $0
XPC850DEVR80BU- ND	XPC850DEVR80BU	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA-ATA, TDM, UART/USART Base Part Number: PC850	1000 Order	1+: $0
MPC860SRZQ66D4R 2-ND	MPC860SRZQ66D4R 2	NXP USA Inc	View more Series: MPC8xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (4) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC860	1000 Order	1+: $0
SCF5235F4CVM150 -ND	SCF5235F4CVM150	NXP USA Inc	View more Series: MCF523x Packaging: Tray Part Status: Not For New Designs Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 150MHz Connectivity: CANbus, EBI/EMI, Ethernet, IC, SPI, UART/USART Peripherals: DMA, WDT Number of I/O: 97 Program Memory Type: ROMless RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA (17x17)	1000 Order	450+: $21.9177
568-4222-2-ND	PCA9674BS,118	NXP USA Inc	View more Packaging: Tape & Reel (TR) Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Last Time Buy Moisture Sensitivity Level (MSL): 1 (Unlimited) Number of I/O: 8 Interface: IC Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100A, 25mA Clock Frequency: 1MHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 16-VFQFN Exposed Pad Supplier Device Package: 16-HVQFN (3x3) Base Part Number: PCA9674	1000 Order	1+: $0
568-11940-2-ND	PCA9506DGG,518	NXP USA Inc	View more Packaging: Tape & Reel (TR) Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 3 (168 Hours) Number of I/O: 40 Interface: IC Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP Base Part Number: PCA9506	2000 Order	2000+: $1.1979
568-1051-5-ND	PCA9554AD,112	NXP USA Inc	View more Packaging: Tube Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Obsolete Moisture Sensitivity Level (MSL): 1 (Unlimited) Number of I/O: 8 Interface: IC, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SO Base Part Number: PCA9554	883 Order	1+: $0.9828 10+: $0.8782 100+: $0.6849 500+: $0.5658
KXPC823VR66B2T- ND	KXPC823VR66B2T	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10 Mbps (1) USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: IC, SMC, SCC, SPI, UART Base Part Number: PC823	1000 Order	1+: $0
XPC850DEZT50BUR 2-ND	XPC850DEZT50BUR 2	NXP USA Inc	View more Series: MPC8xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA-ATA, TDM, UART/USART Base Part Number: PC850	1000 Order	1+: $0
568-11490-2-ND	PCAL6416AERJ	NXP USA Inc	View more Series: Agile Packaging: Tape & Reel (TR) Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Obsolete Moisture Sensitivity Level (MSL): 1 (Unlimited) Number of I/O: 16 Interface: IC, SMBus Interrupt Output: Yes Features: POR Output Type: Open Drain, Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 1.65 V ~ 5.5 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 24-UFBGA Supplier Device Package: 24-UFBGA (2x2) Base Part Number: PCAL6416	1000 Order	1+: $0
MPC857TVR66B-ND	MPC857TVR66B	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 105C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC857	1000 Order	1+: $0
MC9328MXSVP10-N D	MC9328MXSVP10	NXP USA Inc	View more Series: i.MXS Packaging: Tray Part Status: Not For New Designs Core Processor: ARM920T Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD USB: USB 1.x (1) Voltage - I/O: 1.8V, 3.0V Operating Temperature: 0C ~ 70C (TA) Package / Case: 225-LFBGA Supplier Device Package: 225-MAPBGA (13x13) Additional Interfaces: IC, IS, SPI, SSI, UART Base Part Number: MC9328MXS	1000 Order	800+: $6.4036
MPC860PCVR50D4- ND	MPC860PCVR50D4	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Not For New Designs Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (4), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC860	1000 Order	44+: $63.2614
XPC850DSLVR50BU -ND	XPC850DSLVR50BU	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA-ATA, TDM, UART/USART Base Part Number: PC850	1000 Order	1+: $0
KMPC860PCVR66D4 -ND	KMPC860PCVR66D4	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (4), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC860	1000 Order	1+: $0
KMPC860SRCZQ50D 4-ND	KMPC860SRCZQ50D 4	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (4) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC860	1000 Order	1+: $0
MCF5307FT90B-ND	MCF5307FT90B	NXP USA Inc	View more Series: MCF530x Packaging: Tray Part Status: Obsolete Core Processor: Coldfire V3 Core Size: 32-Bit Speed: 90MHz Connectivity: EBI/EMI, IC, UART/USART Peripherals: DMA, POR, WDT Number of I/O: 16 Program Memory Type: ROMless RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 208-BFQFP Supplier Device Package: 208-FQFP (28x28) Base Part Number: MCF5307	1000 Order	1+: $0
XPC850CZT50BUR2 -ND	XPC850CZT50BUR2	NXP USA Inc	View more Series: MPC8xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA-ATA, TDM, UART/USART Base Part Number: PC850	1000 Order	1+: $0
MCF5407CFT162-N D	MCF5407CFT162	NXP USA Inc	View more Series: MCF540x Packaging: Tray Part Status: Obsolete Core Processor: Coldfire V4 Core Size: 32-Bit Speed: 162MHz Connectivity: EBI/EMI, IC, UART/USART Peripherals: DMA, WDT Number of I/O: 16 Program Memory Type: ROMless RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 208-BFQFP Supplier Device Package: 208-FQFP (28x28) Base Part Number: MCF5407	1000 Order	1+: $0
MCF5206AB33A-ND	MCF5206AB33A	NXP USA Inc	View more Series: MCF520x Packaging: Tray Part Status: Obsolete Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 33MHz Connectivity: IC, UART/USART Peripherals: POR, WDT Number of I/O: 8 Program Memory Type: ROMless RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28x28) Base Part Number: MCF5206	1000 Order	--
KMPC857TCVR80B- ND	KMPC857TCVR80B	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 115C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC857	1000 Order	1+: $0
SCF5249LAG133-N D	SCF5249LAG133	NXP USA Inc	View more Series: MCF524x Packaging: Tray Part Status: Not For New Designs Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 133MHz Connectivity: IC, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, IS, POR, Serial Audio, WDT Number of I/O: 34 Program Memory Type: ROMless RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 4x12b Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	1000 Order	300+: $14.5795
MPC860SRVR66D4R 2-ND	MPC860SRVR66D4R 2	NXP USA Inc	View more Series: MPC8xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (4) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC860	1000 Order	1+: $0
KMPC862TVR100B- ND	KMPC862TVR100B	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (4), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 105C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC862	1000 Order	1+: $0
MPC850SRZQ80BU- ND	MPC850SRZQ80BU	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA-ATA, TDM, UART/USART Base Part Number: MPC850	1000 Order	1+: $0
568-11941-2-ND	PCA9505DGG,118	NXP USA Inc	View more Packaging: Tape & Reel (TR) Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 1 (Unlimited) Number of I/O: 40 Interface: IC Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP Base Part Number: PCA9505	1000 Order	2000+: $1.1979
MCF5484CZP200-N D	MCF5484CZP200	NXP USA Inc	View more Series: MCF548x Packaging: Tray Part Status: Not For New Designs Core Processor: Coldfire V4E Core Size: 32-Bit Speed: 200MHz Connectivity: CANbus, EBI/EMI, Ethernet, IC, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Number of I/O: 99 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27) Base Part Number: MCF5484	903 Order	1+: $35.7399 10+: $33.5721 100+: $30.1066
MPC880VR66-ND	MPC880VR66	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Active Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (2), 10/100 Mbps (2) USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC880	1000 Order	--
UDA1380TT/N2,51 2-ND	UDA1380TT/N2,51 2	NXP USA Inc	View more Part Status: Obsolete Type: Stereo Audio Data Interface: IC, Serial Resolution (Bits): 24 b Number of ADCs / DACs: 2 / 2 Sigma Delta: No S/N Ratio, ADCs / DACs (db) Typ: 97 / 97 Voltage - Supply, Analog: 2.4 V ~ 3.6 V Voltage - Supply, Digital: 2.4 V ~ 3.6 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 32-TSSOP (0.240", 6.10mm Width) Supplier Device Package: 32-TSSOP Base Part Number: UDA1380	1000 Order	1+: $0
MPC855TCVR66D4- ND	MPC855TCVR66D4	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Not For New Designs Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1), 10/100 Mbps (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MPC855	1000 Order	44+: $32.5364
MC860DECVR50D4R 2TR-ND	MC860DECVR50D4R 2	NXP USA Inc	View more Series: MPC8xx Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (2) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25) Additional Interfaces: IC, IrDA, PCMCIA, SPI, TDM, UART/USART Base Part Number: MC860	1000 Order	1+: $0
XPC850DECZT66BU -ND	XPC850DECZT66BU	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: -40C ~ 95C (TA) Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA-ATA, TDM, UART/USART Base Part Number: PC850	1000 Order	1+: $0
XPC850DSLZT50BU -ND	XPC850DSLZT50BU	NXP USA Inc	View more Series: MPC8xx Packaging: Tray Part Status: Obsolete Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10 Mbps (1) USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0C ~ 95C (TA) Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23x23) Additional Interfaces: HDLC/SDLC, IC, IrDA, PCMCIA-ATA, TDM, UART/USART Base Part Number: PC850	10 Order	--

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