Nxp decoder interface - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
568-4951-ND	LPC1113FHN33/30 1,5	NXP USA Inc	View more Series: LPC1100 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: IC, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7) Base Part Number: LPC1113	1000 Order	260+: $1.2121
LPC1342FHN33,51 8-ND	LPC1342FHN33,51 8	NXP USA Inc	View more Series: LPC13xx Packaging: Tape & Reel (TR) Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 72MHz Connectivity: IC, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7) Base Part Number: LPC1342	1000 Order	4000+: $1.2233
S9S08AW32E7CFDE -ND	S9S08AW32E7CFDE	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 38 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: S9S08AW32	1000 Order	1300+: $2.1433
MK10DX64VLK7R-N D	MK10DX64VLK7R	NXP USA Inc	View more Series: Kinetis K10 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SPI, UART/USART Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 31x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12) Base Part Number: MK10DX64	1000 Order	1000+: $2.2113
MCF51JF64VLF-ND	MCF51JF64VLF	NXP USA Inc	View more Series: MCF51Jx Packaging: Tray Part Status: Active Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: EBI/EMI, IC, SPI, UART/USART, USB OTG Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 35 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 11x12b, D/A 1x12b Oscillator Type: External Operating Temperature: -40C ~ 105C (TA) Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MCF51JF64	1000 Order	250+: $2.5525
S9S12G96ACLH-ND	S9S12G96ACLH	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 3K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	1000 Order	160+: $2.5799
MCF51JF128VHS-N D	MCF51JF128VHS	NXP USA Inc	View more Series: MCF51Jx Packaging: Tray Part Status: Active Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: EBI/EMI, IC, SPI, UART/USART, USB OTG Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 9x12b, D/A 1x12b Oscillator Type: External Operating Temperature: -40C ~ 105C (TA) Package / Case: 44-VFLGA Exposed Pad Supplier Device Package: 44-MAPLGA (5x5) Base Part Number: MCF51JF128	1000 Order	490+: $2.7273
S9S12G128AVLH-N D	S9S12G128AVLH	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	1000 Order	160+: $2.973
S912ZVC19F0MKH- ND	S912ZVC19F0MKH	NXP USA Inc	View more Series: S12 MagniV Packaging: Tray Part Status: Active Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, IC, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 16x10b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	1000 Order	800+: $3.1053
S912ZVHL64F1CLQ -ND	S912ZVHL64F1CLQ	NXP USA Inc	View more Series: S12 MagniV Packaging: Tray Part Status: Active Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, IC, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	1000 Order	300+: $3.3951
S9S12G240F0MLH- ND	S9S12G240F0MLH	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 240KB (240K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 11K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	1000 Order	--
MC9S08AC128MFGE -ND	MC9S08AC128MFGE	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 38 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10) Base Part Number: MC9S08AC128	1000 Order	800+: $3.447
S912XHY256F0VLL R-ND	S912XHY256F0VLL R	NXP USA Inc	View more Series: HCS12X Packaging: Tape & Reel (TR) Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 40MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 76 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 8K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40C ~ 105C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	1000 Order	1000+: $3.7677
MK22FN1M0VLK12R -ND	MK22FN1M0VLK12R	NXP USA Inc	View more Series: Kinetis K20 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 27x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	1000 Order	1000+: $4.8347
MC56F84565VLK-N D	MC56F84565VLK	NXP USA Inc	View more Series: 56F8xxx Packaging: Tray Part Status: Active Core Processor: 56800EX Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, IC, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Number of I/O: 68 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 16x12b, 8x16b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12) Base Part Number: MC56F845	1000 Order	96+: $5.321
S912XEG128BMAAR -ND	S912XEG128BMAAR	NXP USA Inc	View more Series: HCS12X Packaging: Tape & Reel (TR) Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	1000 Order	750+: $5.545
SPC5604BACLL6R- ND	SPC5604BACLL6R	NXP USA Inc	View more Series: MPC56xx Qorivva Packaging: Tape & Reel (TR) Part Status: Active Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, IC, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	1000 Order	1000+: $5.5804
MK51DN512ZCLL10 -ND	MK51DN512ZCLL10	NXP USA Inc	View more Series: Kinetis K50 Packaging: Tray Part Status: Not For New Designs Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: IC, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, IS, LCD, LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 35x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14) Base Part Number: MK51DN512	1000 Order	--
S912XEQ384J3VAG R-ND	S912XEQ384J3VAG R	NXP USA Inc	View more Series: HCS12X Packaging: Tape & Reel (TR) Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40C ~ 105C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	1000 Order	--
S912XEQ384F1MAL -ND	S912XEQ384F1MAL	NXP USA Inc	View more Series: HCS12X Packaging: Tray Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	1000 Order	--
S9S12D64F0VFUE- ND	S9S12D64F0VFUE	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Not For New Designs Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IC, SCI, SPI Peripherals: PWM, WDT Number of I/O: 59 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14) Base Part Number: S9S12D64	1000 Order	420+: $8.7494
S908AB32AH3MFUE -ND	S908AB32AH3MFUE	NXP USA Inc	View more Series: HC08 Packaging: Tray Part Status: Not For New Designs Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: POR, PWM Number of I/O: 51 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	1000 Order	420+: $9.1715
SPC5744PK1AMLQ9 -ND	SPC5744PK1AMLQ9	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	300+: $9.3634
SPC5746CBK1AMMJ 6-ND	SPC5746CBK1AMMJ 6	NXP USA Inc	View more Series: MPC57xx Packaging: Tray Part Status: Active Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, IC, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	1000 Order	450+: $15.292
MC68332AMEH16-N D	MC68332AMEH16	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Not For New Designs Core Processor: CPU32 Core Size: 32-Bit Speed: 16MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 15 Program Memory Type: ROMless RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (24.13x24.13) Base Part Number: MC68332	1000 Order	180+: $19.4485
S912DG128H4VPVE R-ND	S912DG128H4VPVE R	NXP USA Inc	View more Series: HC12 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: CPU12 Core Size: 16-Bit Speed: 8MHz Connectivity: CANbus, IC, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 69 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 16x8/10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	1000 Order	500+: $22.749
MC908QY4MDWERTR -ND	MC908QY4MDWER	NXP USA Inc	View more Series: HC08 Packaging: Tape & Reel (TR) Part Status: Obsolete Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Peripherals: LVD, POR, PWM Number of I/O: 5 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC Base Part Number: MC908QY4	1000 Order	1+: $0
MC100ES6111FAR2 TR-ND	MC100ES6111FAR2	NXP USA Inc	View more Series: 100ES Packaging: Tape & Reel (TR) Part Status: Obsolete Type: Fanout Buffer (Distribution), Multiplexer Number of Circuits: 1 Ratio - Input:Output: 2:10 Differential - Input:Output: Yes/Yes Input: ECL, HSTL, PECL Output: ECL, PECL Frequency - Max: 2.7GHz Voltage - Supply: 2.375 V ~ 3.465 V Operating Temperature: -40C ~ 110C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (9x9) Base Part Number: MC100ES6111	1000 Order	1+: $0
568-5750-5-ND	PCK351DB,112	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Type: Fanout Buffer (Distribution) Number of Circuits: 1 Ratio - Input:Output: 1:10 Differential - Input:Output: No/No Input: LVTTL Output: LVTTL Frequency - Max: 125MHz Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP Base Part Number: PCK351	1000 Order	1+: $0
568-1306-ND	SAA7103H/V4,557	NXP USA Inc	View more Packaging: Tray Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Obsolete Moisture Sensitivity Level (MSL): 3 (168 Hours) Type: Video Encoder Applications: Graphics Controller Voltage - Supply, Analog: 3.15 V ~ 3.45 V Voltage - Supply, Digital: 3 V ~ 3.6 V Mounting Type: Surface Mount Package / Case: 44-QFP Supplier Device Package: 44-PQFP (10x10) Base Part Number: SAA7103	1000 Order	1+: $0
568-8433-2-ND	LD6806CX4/36H,3 15	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 3.6V Voltage Dropout (Max): 0.1V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): 100A Current - Supply (Max): 250A PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 4-XFBGA, WLCSP Supplier Device Package: 4-WLCSP (0.76x0.76) Base Part Number: LD6806	1000 Order	1+: $0
SSTUH32864EC,51 8-ND	SSTUH32864EC,51 8	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Logic Type: 1:2 Configurable Registered Buffer Supply Voltage: 1.7 V ~ 1.9 V Number of Bits: 25, 14 Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5) Base Part Number: 74SSTUH32864	1000 Order	1+: $0
TDA9983BHW/15/C 1;5-ND	TDA9983BHW/15/C 1;5	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Type: Transmitter Applications: Recorders, Set-Top Boxes Mounting Type: Surface Mount Package / Case: 80-TQFP Exposed Pad Supplier Device Package: 80-HTQFP (12x12) Base Part Number: TDA9983	1000 Order	1+: $0
MC68882RC40A-ND	MC68882RC40A	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Type: Floating-Point Co-Processor Mounting Type: Through Hole Package / Case: 68-BCPGA Supplier Device Package: 68-PGA (26.92x26.92) Base Part Number: MC68882	1000 Order	1+: $0
MC34VR5100A2EP- ND	MC34VR5100A2EP	NXP USA Inc	View more Packaging: Tray Part Status: Active Topology: Step-Down (Buck) (3), Linear (LDO) (6) Function: Communications Processors Number of Outputs: 9 Voltage/Current - Output 1: 1.8V/3.3V/0.7 V ~ 1.425 V, 3.8A Voltage/Current - Output 2: 1.5 V ~ 1.85 V/2.5 V ~ 3.3 V, 1.25A Voltage/Current - Output 3: 0.9 V ~ 1.65 V, 1.5A w/LED Driver: No w/Supervisor: No w/Sequencer: No Voltage - Supply: 2.8 V ~ 4.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	1040 Order	1+: $3.5091 10+: $3.1494 100+: $2.5804 500+: $2.1966 1000+: $1.8526
MC34VR5100A0EPR 2-ND	MC34VR5100A0EPR 2	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	4000+: $1.7599
MC33FS6501CAE-N D	MC33FS6501CAE	NXP USA Inc	View more Series: * Packaging: Tray Part Status: Active Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	1000 Order	250+: $3.5664
MPX2202D-ND	MPX2202D	NXP USA Inc	View more Series: MPX2202 Part Status: Obsolete Pressure Type: Differential Operating Pressure: 29.01 PSI (200 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Voltage - Supply: 10 V ~ 16 V Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40C ~ 125C Package / Case: 4-SIP Module	1000 Order	1+: $0
TDA3616SF/N1,11 2-ND	TDA3616SF/N1,11 2	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Processor Current - Supply: 95A Voltage - Supply: 5.6 V ~ 25 V Operating Temperature: -40C ~ 105C Mounting Type: Through Hole Package / Case: 9-SIP Exposed Tab Supplier Device Package: 9-SIL MPF Base Part Number: TDA3616	1000 Order	1+: $0
TDA3616T/N1,112 -ND	TDA3616T/N1,112	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Processor Current - Supply: 95A Voltage - Supply: 5.6 V ~ 25 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO Base Part Number: TDA3616	1000 Order	1+: $0

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