Nxp multiplexers interface - Allicdata Electronics

Related Categories

< 1 2 3 4 5 >

Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
MM912G634DC2AP- ND	MM912G634DC2AP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912G634	1000 Order	250+: $4.027
568-12070-ND	ASC8852AETE	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8852	1000 Order	1+: $0
ASC8850ET/M2,55 7-ND	ASC8850ET/M2,55 7	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8850	1000 Order	1+: $0
MM912F634DV2AP- ND	MM912F634DV2AP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912F634	1000 Order	--
ASC8851ET/M2,55 7-ND	ASC8851ET/M2,55 7	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8851	1000 Order	1+: $0
A7001AGHN1/T1AG 315-ND	A7001AGHN1/T1AG 315	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Authentication Core Processor: MX51 Program Memory Type: EEPROM (76.4 kB) Controller Series: A700x RAM Size: 3.2kB Interface: IC, 2-Wire Serial Voltage - Supply: 1.62 V ~ 5.5 V Operating Temperature: -25C ~ 85C Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5) Base Part Number: A700*	1000 Order	1+: $0
EM783-SPE-ND	EM783-SPE	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Energy Measurement Core Processor: ARM Cortex-M0 Program Memory Type: FLASH (32 kB) RAM Size: 8K x 8 Interface: IC, IrDA, SPI, UART/USART Number of I/O: 22 Voltage - Supply: 2.6 V ~ 3.6 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	1000 Order	1+: $0
PNX1302EH,557-N D	PNX1302EH,557	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Multimedia Core Processor: TriMedia Controller Series: Nexperia RAM Size: 48K x 8 Interface: IC, 2-Wire Serial Number of I/O: 169 Voltage - Supply: 2.375 V ~ 2.625 V Operating Temperature: 0C ~ 85C Mounting Type: Surface Mount Package / Case: 292-HBGA Supplier Device Package: 292-BGA Base Part Number: PNX13*	1000 Order	1+: $0
ASC8848ET/M2,55 7-ND	ASC8848ET/M2,55 7	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8848	1000 Order	1+: $0
PNX1301EH,557-N D	PNX1301EH,557	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Multimedia Core Processor: TriMedia Controller Series: Nexperia RAM Size: 48K x 8 Interface: IC, 2-Wire Serial Number of I/O: 169 Voltage - Supply: 2.375 V ~ 2.625 V Operating Temperature: 0C ~ 85C Mounting Type: Surface Mount Package / Case: 292-HBGA Supplier Device Package: 292-BGA Base Part Number: PNX13*	1000 Order	1+: $0
MM912KS812AMAFR 2-ND	MM912KS812AMAFR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (256 kB) Controller Series: HCS12 RAM Size: 12K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14)	1000 Order	1000+: $3.6851
MM912G634DV2APR 2-ND	MM912G634DV2APR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: MM912G634	1000 Order	2000+: $3.6281
MM912F634CV1AE- ND	MM912F634CV1AE	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912F634	1000 Order	--
A7002CMHN1/T1AG BEL-ND	A7002CMHN1/T1AG BEL	NXP USA Inc	View more Part Status: Active Applications: Authentication Core Processor: MX51 Program Memory Type: EEPROM (76.4 kB) Controller Series: A700x RAM Size: 3.2kB Interface: IC, 2-Wire Serial Voltage - Supply: 1.62 V ~ 5.5 V Operating Temperature: -40C ~ 90C	1000 Order	2450+: $1.3825
568-14449-ND	MM912H634DM1AE	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (64 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912H634	250 Order	--
568-14266-ND	ASC8851AETE	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8851	126 Order	--
ASC8849AETK-ND	ASC8849AETK	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9 Interface: EBI/EMI, Ethernet, IS, IrDA, SD/MMC, SPI, UART/USART, USB OTG Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15) Base Part Number: ASC8849	1000 Order	1+: $0
568-14066-2-ND	A7102CHTK2/T0BC 2AJ	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Authentication Core Processor: MX51 Interface: IC Voltage - Supply: 2.5 V ~ 3.6 V Operating Temperature: -40C ~ 90C (TA) Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (4x4)	1000 Order	6000+: $0.8211
MM908E626AVPEK- ND	MM908E626AVPEK	NXP USA Inc	View more Packaging: Tube Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 115C Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC Base Part Number: MM908E626	1000 Order	--
MM908E622ACDWB- ND	MM908E622ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
MM912G634CV1AER 2-ND	MM912G634CV1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.25 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912G634	1000 Order	1+: $0
568-14332-ND	MM912I637AV1EP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: MM912I637	260 Order	1+: $5.4999 10+: $4.9663 100+: $4.1114 500+: $3.5801 1000+: $3.1182
MM908E621ACDWB- ND	MM908E621ACDWB	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E621	1000 Order	1+: $0
568-14088-ND	MM912J637AM2EP	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7) Base Part Number: MM912J637	1300 Order	--
MM908E621ACDWBR 2-ND	MM908E621ACDWBR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E621	1000 Order	1+: $0
MM912F634BV1AER 2-ND	MM912F634BV1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912F634	1000 Order	1+: $0
MM912IP812AMAF- ND	MM912IP812AMAF	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912IP812	1000 Order	450+: $2.7203
MM912G634DC1AER 2-ND	MM912G634DC1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912G634	1000 Order	2000+: $3.3851
MM912H634DM1AER 2-ND	MM912H634DM1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (64 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912H634	1000 Order	2000+: $1.8434
MM908E624ACEW-N D	MM908E624ACEW	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E625ACPEKR 2-ND	MM908E625ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC	1000 Order	1000+: $3.5211
MM912H634DV1AER 2-ND	MM912H634DV1AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (64 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912H634	1000 Order	--
MM908E624ACEWR2 TR-ND	MM908E624ACEWR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E624ACDWBR 2-ND	MM908E624ACDWBR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC Base Part Number: MM908E624	1000 Order	--
MM908E622ACEK-N D	MM908E622ACEK	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP Base Part Number: MM908E622	1000 Order	--
MM908E621ACPEKR 2-ND	MM908E621ACPEKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC W EP Base Part Number: MM908E621	1000 Order	1000+: $3.5721
MM912JP812AMAF- ND	MM912JP812AMAF	NXP USA Inc	View more Packaging: Tray Part Status: Active Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912JP812	1000 Order	90+: $3.3967
MM912JS812AMAFR 2-ND	MM912JS812AMAFR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 8K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912JS812	1000 Order	800+: $2.8612
MM912F634DV2AER 2-ND	MM912F634DV2AER 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40C ~ 105C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Base Part Number: MM912F634	1000 Order	2000+: $1.3239
MM912IP812AMAFR 2-ND	MM912IP812AMAFR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40C ~ 125C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14) Base Part Number: MM912IP812	1000 Order	800+: $2.4803

< 1 2 3 4 5 >

Hot Searches: nxp multiplexers interface on multiplexers interface nxp demultiplexers interface nxp logic multiplexer adsantec multiplexers interface advanced multiplexers interface alpha multiplexers interface omega multiplexers interface ams multiplexers interface analog multiplexers interface burr multiplexers interface diodes multiplexers interface fairchild multiplexers interface gennum multiplexers interface harris multiplexers interface holt multiplexers interface idt multiplexers interface infineon multiplexers interface intersil multiplexers interface linear multiplexers interface

Search Result:nxp multiplexers interface

Related Categories