Programmable modulator ic - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
672-1023-2-ND	SARA-U280-03S	U-Blox America Inc.	View more Series: SARA-U2 Packaging: Tape & Reel (TR) Part Status: Active RF Family/Standard: Cellular Protocol: HSPA Frequency: 850MHz, 1.9GHz Data Rate: 72Mbps Sensitivity: -111dBm Antenna Type: Not Included Voltage - Supply: 3.8V Current - Receiving: 620mA Serial Interfaces: SPI, UART Current - Transmitting: 620mA Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C Package / Case: 96-SMD Module	1000 Order	250+: $16.8022
ZICM3588SP2-1C- R-ND	ZICM3588SP2-1C- R	CEL	View more Series: MeshConnect Packaging: Tape & Reel (TR) Part Status: Not For New Designs RF Family/Standard: 802.15.4 Protocol: Zigbee Frequency: 2.4GHz Data Rate: 250kbps Power - Output: 20dBm Sensitivity: -103dBm Serial Interfaces: JTAG, SPI, UART Antenna Type: Not Included, Castellation Utilized IC / Part: EM3588 Memory Size: 512kB Flash, 64kB SRAM Voltage - Supply: 2.1 V ~ 3.6 V Current - Receiving: 34mA Current - Transmitting: 58mA ~ 150mA Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C Package / Case: 33-SMD Module	1000 Order	600+: $12.766
450-0144C-ND	450-0144C	Laird - Wireless & Thermal Systems	View more Series: SaBLE-x Packaging: Cut Strip Part Status: Active RF Family/Standard: Bluetooth Protocol: Bluetooth v4.1, Class 2 Frequency: 2.4GHz Power - Output: 5.3dBm Sensitivity: -96.1dBm Serial Interfaces: JTAG, UART Antenna Type: Not Included Utilized IC / Part: CC2640 Memory Size: 128kB Flash, 20kB SRAM Voltage - Supply: 1.8 V ~ 3.8 V Current - Receiving: 7mA ~ 11.8mA Current - Transmitting: 7.9mA ~ 13.6mA Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C Package / Case: 39-SMD Module	1283 Order	1+: $7.0308
P13684TR-ND	ENW-C9A09N4EF	Panasonic Electronic Components	View more Series: PAN4555 Packaging: Tape & Reel (TR) Part Status: Obsolete RF Family/Standard: 802.15.4 Protocol: Zigbee Frequency: 2.4GHz Data Rate: 250kbps Power - Output: 0dBm Sensitivity: -92dBm Utilized IC / Part: MC13213 Memory Size: 60kB Flash, 4kB RAM Voltage - Supply: 2 V ~ 3.4 V Current - Receiving: 42mA Current - Transmitting: 35mA Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C Package / Case: PCB Module	1000 Order	1+: $0
ZICM357SP2-1C-H T-R-ND	ZICM357SP2-1C-H T-R	CEL	View more Series: MeshConnect Packaging: Tape & Reel (TR) Part Status: Active RF Family/Standard: 802.15.4 Protocol: Zigbee Frequency: 2.4GHz Data Rate: 250kbps Power - Output: 20dBm Sensitivity: -103dBm Serial Interfaces: JTAG, SPI, UART Antenna Type: Not Included, Castellation Utilized IC / Part: EM357 Memory Size: 192kB Flash, 12kB SRAM Voltage - Supply: 2.1 V ~ 3.6 V Current - Receiving: 34mA Current - Transmitting: 150mA ~ 175mA Mounting Type: Surface Mount Operating Temperature: -40C ~ 110C Package / Case: Module	1000 Order	600+: $20.1096
P14774TR-ND	ENW-89827C2JF	Panasonic Electronic Components	View more Series: PAN1317 Packaging: Tape & Reel (TR) Part Status: Obsolete RF Family/Standard: Bluetooth Protocol: Bluetooth v4.0 Modulation: GFSK Frequency: 2.4GHz Data Rate: 3Mbps Power - Output: 10dBm Sensitivity: -93dBm Serial Interfaces: IS, UART Antenna Type: Not Included Utilized IC / Part: CC2567 Voltage - Supply: 1.7 V ~ 4.8 V Current - Receiving: 33mA Current - Transmitting: 33mA Mounting Type: Surface Mount Operating Temperature: -20C ~ 70C Package / Case: PCB Module	1000 Order	1+: $0
ZICM3588SP2-2-R TR-ND	ZICM3588SP2-2-R	CEL	View more Series: MeshConnect Packaging: Tape & Reel (TR) Part Status: Active RF Family/Standard: 802.15.4 Protocol: Zigbee Frequency: 2.4GHz Data Rate: 250kbps Power - Output: 20dBm Sensitivity: -103dBm Serial Interfaces: SPI, UART Antenna Type: Not Included, Castellation Utilized IC / Part: EM3588 Memory Size: 512kB Flash, 64kB SRAM Voltage - Supply: 3.3V Current - Receiving: 34mA Current - Transmitting: 150mA Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C Package / Case: Module	600 Order	600+: $12.766
ZICM357SP2-2C-R -ND	ZICM357SP2-2C-R	CEL	View more Series: MeshConnect Packaging: Tape & Reel (TR) Part Status: Active RF Family/Standard: 802.15.4 Protocol: Zigbee Frequency: 2.4GHz Data Rate: 250kbps Power - Output: 20dBm Sensitivity: -103dBm Serial Interfaces: JTAG, SPI, UART Antenna Type: Not Included, Castellation Utilized IC / Part: EM357 Memory Size: 192kB Flash, 12kB SRAM Voltage - Supply: 2.1 V ~ 3.6 V Current - Receiving: 34mA Current - Transmitting: 58mA ~ 150mA Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C Package / Case: Module	1000 Order	600+: $10.3081
1475-1063-ND	ISM43362-M3G-L4 4-E-C3.5.2.4	Inventek Systems	View more Series: eS-WiFi, WICED Part Status: Active RF Family/Standard: WiFi Protocol: 802.11b/g/n Modulation: 16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK Frequency: 2.4GHz Data Rate: 72.2Mbps Power - Output: 18dBm Sensitivity: -93dBm Serial Interfaces: SPI, UART, USB Antenna Type: Not Included, U.FL Utilized IC / Part: BCM43362 Memory Size: 1MB Flash Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C Package / Case: 44-SMD Module	1000 Order	1+: $8.505 100+: $7.9381 500+: $7.4419
602-1381-ND	XB2B-WFRS-001	Digi International	View more Series: XBee Wi-Fi Packaging: Bulk Part Status: Active RF Family/Standard: WiFi Protocol: 802.11b/g/n Modulation: 16QAM, 64QAM, BPSK, CCK, DSSS, OFDM, QPSK Frequency: 2.4GHz Data Rate: 72Mbps Power - Output: 16dBm Sensitivity: -93dBm Serial Interfaces: SPI, UART Antenna Type: Not Included Voltage - Supply: 3.14 V ~ 3.46 V Current - Receiving: 100mA Current - Transmitting: 309mA Mounting Type: Surface Mount Operating Temperature: -30C ~ 85C Package / Case: Module	40 Order	1+: $18.27 100+: $17.1282
450-0126-ND	450-0126	Laird - Wireless & Thermal Systems	View more Series: SiFLEX02-R2 Packaging: Tray Part Status: Obsolete RF Family/Standard: 802.15.4 Protocol: Zigbee Modulation: BPSK, O-QPSK Frequency: 900MHz Data Rate: 1Mbps Power - Output: 24dBm Sensitivity: -102dBm Serial Interfaces: JTAG, SPI, UART Antenna Type: Not Included, Castellation Utilized IC / Part: AT86RF212B Memory Size: 256kB Flash, 4kB EEPROM, 16kB RAM Voltage - Supply: 2 V ~ 3.45 V Current - Receiving: 30mA Current - Transmitting: 285mA Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C Package / Case: Module	1000 Order	1+: $0
ZICM3588SP0-1C- MW-ND	ZICM3588SP0-1C- MW	CEL	View more Series: MeshConnect Packaging: Tray Part Status: Obsolete RF Family/Standard: 802.15.4 Protocol: Zigbee Frequency: 2.4GHz Data Rate: 250kbps Power - Output: 8dBm Sensitivity: -100dBm Serial Interfaces: JTAG, SPI, UART Antenna Type: Not Included, Castellation Utilized IC / Part: EM3588 Memory Size: 512kB Flash, 64kB SRAM Voltage - Supply: 2.1 V ~ 3.6 V Current - Receiving: 30mA Current - Transmitting: 31mA ~ 44mA Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C Package / Case: Module	1000 Order	1+: $0
1115-1001-ND	072-0111	LM Technologies	View more Packaging: Tray Part Status: Discontinued at Digi-Key RF Family/Standard: Bluetooth Protocol: Bluetooth v2.1 + EDR, Class 1 Frequency: 2.4GHz Data Rate: 3Mbps Power - Output: 16.5dBm Sensitivity: -88dBm Serial Interfaces: PIO, SPI, UART, USB Antenna Type: Not Included Utilized IC / Part: BlueCore4 Memory Size: 8MB Flash Voltage - Supply: 2.7 V ~ 3.6 V Current - Receiving: 114mA Current - Transmitting: 114mA Mounting Type: Surface Mount Operating Temperature: -20C ~ 70C Package / Case: Module	189 Order	1+: $7.0686
1475-1062-ND	ISM43362-M3G-L4 4-U-C3.5.2.4	Inventek Systems	View more Series: eS-WiFi, WICED Part Status: Active RF Family/Standard: WiFi Protocol: 802.11b/g/n Modulation: 16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK Frequency: 2.4GHz Data Rate: 72.2Mbps Power - Output: 18dBm Sensitivity: -93dBm Serial Interfaces: SPI, UART, USB Antenna Type: Not Included, U.FL Utilized IC / Part: BCM43362 Memory Size: 1MB Flash Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C Package / Case: 44-SMD Module	25 Order	1+: $8.5491 100+: $7.9822 500+: $7.4844
M2S010TS-VF256- ND	M2S010TS-VF256	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-VFBGA Supplier Device Package: 256-BGA (17x17) Number of I/O: 138	1000 Order	119+: $23.7857
M2S010T-VFG256I -ND	M2S010T-VFG256I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138	1000 Order	119+: $23.0485
M2S050TS-1FGG89 6-ND	M2S050TS-1FGG89 6	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377	1000 Order	27+: $92.085
M2S150-FCSG536- ND	M2S150-FCSG536	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 536-LFBGA Supplier Device Package: 536-BGA (16x16) Number of I/O: 293	1000 Order	90+: $165.008
M2S050S-1FGG484 I-ND	M2S050S-1FGG484 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267 Base Part Number: M2S050S	1000 Order	1+: $0
M2S050T-FCSG325 -ND	M2S050T-FCSG325	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 200	1000 Order	176+: $49.4991
M2S060T-1FG484- ND	M2S060T-1FG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $74.4296
M2S060TS-1FG676 I-ND	M2S060TS-1FG676 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $92.085
M2S050T-1FG896I -ND	M2S050T-1FG896I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 896-FBGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377 Base Part Number: M2S050T	1000 Order	27+: $92.085
M2S150-FCS536-N D	M2S150-FCS536	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 536-LFBGA Supplier Device Package: 536-BGA (16x16) Number of I/O: 293	1000 Order	90+: $165.008
M2S090S-1FG676I -ND	M2S090S-1FG676I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Obsolete Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 425 Base Part Number: M2S090S	1000 Order	1+: $0
M2S005-TQG144-N D	M2S005-TQG144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: 84	1000 Order	60+: $10.1048
M2S010-VFG256-N D	M2S010-VFG256	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138	1000 Order	119+: $19.7786
M2S010TS-VFG256 I-ND	M2S010TS-VFG256 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138	1000 Order	119+: $26.4316
M2S025TS-VFG256 -ND	M2S025TS-VFG256	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138	1000 Order	119+: $43.8348
M2S025T-1VF400- ND	M2S025T-1VF400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 Base Part Number: M2S025T	1000 Order	90+: $45.2882
M2S025T-1VFG400 I-ND	M2S025T-1VFG400 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 Base Part Number: M2S025T	1000 Order	90+: $50.3243
M2S060TS-1VFG40 0I-ND	M2S060TS-1VFG40 0I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207	1000 Order	90+: $86.8273
M2S005S-1VF400- ND	M2S005S-1VF400	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 128KB RAM Size: 64KB Peripherals: DDR Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 169	1000 Order	90+: $14.7263
M2S090-FCSG325- ND	M2S090-FCSG325	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 180	1000 Order	176+: $62.985
M2S060TS-1FGG67 6-ND	M2S060TS-1FGG67 6	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 387	1000 Order	40+: $86.8616
M2S010TS-FGG484 I-ND	M2S010TS-FGG484 I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 233	1000 Order	60+: $34.2468
M2S050T-1FCSG32 5-ND	M2S050T-1FCSG32 5	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 325-TFBGA Supplier Device Package: 325-BGA (11x11) Number of I/O: 200	1000 Order	176+: $55.6823
M2S050TS-FG484- ND	M2S050TS-FG484	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FPBGA (23x23) Number of I/O: 267	1000 Order	60+: $70.882
M2S090T-FG676I- ND	M2S090T-FG676I	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 90K Logic Modules Operating Temperature: -40C ~ 100C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27) Number of I/O: 425	1000 Order	40+: $133.93
M2S010-1TQG144- ND	M2S010-1TQG144	Microsemi Corporation	View more Series: SmartFusion2 Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM Cortex-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, IC, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0C ~ 85C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: 84	1000 Order	60+: $20.2608

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