​The characteristics of Holzer element

On 2018-11-03 15:08:21  in Memory

​The characteristics of Holzer element

The materials used in Holzer devices include germanium,silicon,InSb,InAs,GaAs and so on ...

Wave soldering technology is a mature electronic assembly process

On 2018-10-30 11:33:30  in Memory

Wave soldering technology is a mature electronic assembly process

the process is loading plate,coating flux,preheating,wave soldering,hot air knife treatment,cooling and unloading plate ...

Headphones and piezoceramic buzzers

On 2018-11-03 15:17:06  in Memory

Headphones and piezoceramic buzzers

Headset is also an electro-acoustic conversion device,which is similar in structure to an electric speaker,it is also composed of magnet,voice coil,vibrating diaphragm, etc,but the voice coil of the earphone is mostly fixed ...

Using integrated passive components in the micro-module SIP

On 2018-11-21 11:20:07  in Memory

Using integrated passive components in the micro-module SIP

Integrated passive devices are nothing new in our industry – they have been around for a long time and are well known. ...