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Heat sinks are devices that are used to dissipate thermal energy Transfer from microelectronic components, such as processors and transistors. These components generate a large amount of heat while in operation, and the heat sinks are used to keep the components cool and prevent any damage caused due to overheating. The MHST15055 is a type of heat sink specifically designed for applications in areas with limited space and/or a low profile requirement. It consists of an extruded aluminum base in which a large number of thin, bent aluminum fins are embedded. This type of heat sink is characterized by its low profile, high thermal resistance, excellent air flow, and low cost. This makes it ideal for many different types of applications.The working principle of the MHST15055 is based on the physics of forced convection. Forced convection is defined as the transfer of thermal energy from a solid object to a surrounding air medium through the presence of an airstream. The airstream flows over the surface of the object, which results in a decrease in temperature of the surface and an increase in temperature of the surrounding air. This process causes an equalization of temperature between the heat sink and the ambient air.In the case of the MHST15055, the aluminum fins are designed to create turbulence in the airstream, which enhances the change in temperature and increases the overall thermal resistance of the heat sink. Additionally, the orientation of the fins directs the air flow towards the sides, allowing for a higher heat transfer rate.The MHST15055 is designed for applications in industrial, automotive, and consumer electronics. In industrial applications, it is used to dissipate heat from components such as transformers and high-power electric motors. In automotive applications, it can be used to cool brakes and suspension systems, as well as to dissipate heat from engine components. Finally, in consumer electronics it is used to cool CPUs, GPUs, and other components in electronic devices such as laptops, tablets, and smartphones.Overall, the MHST15055 is an ideal solution for applications with limited space and/or a low profile requirement. Its low profile, high thermal resistance, excellent airflow, and low cost make it particularly suited for a wide range of applications. It is capable of effectively transferring a large amount of heat due to its design and the physics of forced convection, making it a great choice for dissipating thermal energy in any application.
The specific data is subject to PDF, and the above content is for reference
MHST15055 Datasheet/PDF