Allicdata Part #: | MHST05040-ND |
Manufacturer Part#: |
MHST05040 |
Price: | $ 0.00 |
Product Category: | Fans, Thermal Management |
Manufacturer: | GE Critical Power |
Short Description: | HEATSINK 2.27L X.45"H EXTRUSION |
More Detail: | Heat Sink Aluminum Board Level |
DataSheet: | MHST05040 Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | -- |
Part Status: | Obsolete |
Type: | Board Level |
Package Cooled: | -- |
Attachment Method: | Bolt On |
Shape: | Rectangular, Fins |
Length: | 2.270" (57.66mm) |
Width: | 2.401" (61.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.450" (11.43mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Thermal - Heat Sinks
MHST05040 is a thermal management system typically used in power electronic components. It functions by dissipating the heat generated by the component into a thermal conductor which is then moved to an area that is isolated from the component itself. By doing this, the component is kept at a suitable working temperature, improving its performance and longevity.
The MHST05040 heat sink is made from an aluminum extrusion with an integrated heat pipe. The aluminum extrusion is designed to ensure strength and stability for the thermal conductor and the heat pipe nearly guarantees maximum heat transfer between the thermal conductor and the heat sink. The heat pipe is designed so that it is able to quickly move heat from the component to the heat sink and direct it away from the component itself, due to its efficient design and low thermal resistance.
The working principle of the MHST05040 heat sink is relatively simple. The larger thermal conductor connected to the heat pipe is designed to absorb the heat from the component. The thermal conductor is connected to the heat pipe, and this system allows the heat to be moved quickly away from the component, dispersing it into the air or transferring it to a designated area. The heat sink is designed to ensure maximum surface contact with the heat pipe and the thermal conductor, allowing for maximum heat transfer—different configurations available for this contact are available on the MHST05040.
As mentioned above, power electronics are the most common application of MHST05040 heat sinks. This is due to the high volumes of heat generated by these components and the fact that proper thermal management is necessary to ensure these components perform their best. Heat generated by microprocessors and other electronic elements also require heat sinks, as do various industrial processes. In all these cases, the MHST05040 heat sink provides reliable and efficient thermal management.
To put it simply, the MHST05040 heat sink is an efficient and reliable method of thermal management. It is designed to absorb a component’s heat and transfer it to a designated area or disperse it into the air. Thermal management is essential to the performance and longevity of any power electronic component, so it is wise to invest in quality heat sinks such as the MHST05040 for your electronic applications.
The specific data is subject to PDF, and the above content is for reference
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