10104997-V0C-60B Allicdata Electronics
Allicdata Part #:

10104997-V0C-60B-ND

Manufacturer Part#:

10104997-V0C-60B

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: XCEDE 6PVH 6COL RGHT WK
More Detail: N/A
DataSheet: 10104997-V0C-60B datasheet10104997-V0C-60B Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: 6
Voltage Rating: --
Operating Temperature: -55°C ~ 85°C
Material Flammability Rating: UL94 V-0
Current Rating: --
Color: Gray
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold or Gold, GXT™
Features: Key
Contact Layout, Typical: 54 Differential Pairs
Termination: Press-Fit
Mounting Type: Through Hole
Series: XCede®
Number of Rows: --
Pitch: --
Number of Positions Loaded: All
Number of Positions: --
Connector Style: XCede®, Guide Right
Connector Type: Header, Male Pins and Blades
Connector Usage: Backplane
Moisture Sensitivity Level (MSL): --
Part Status: Active
Lead Free Status / RoHS Status: --
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

10104997-V0C-60B is a backplane connector from TE Connectivity, a world leader in connectivity and sensors, and it has great application possibilities and a working principle of enhanced performance for the population of industrial equipment nowadays.

10104997-V0C-60B is comprised of two pieces: a custom-made, steel-insert multi-finger socket contact and a metal housing. This contact arrangement provides a flexible connector for board-to-board interconnects, which is designed to support large data rates and higher current applications. TE Connectivity backplane connectors also feature machined contacts and pins with high contact forces that guarantee reliable data transmission secure without transmission distortion or failure. This enhanced performance is achieved via a combination of enhanced contact design and a metal housing that offers EMI/RFI shielding.

The connector’s unshielded contacts allow for easy design and assembly, while the metal housing provides superior EMI/RFI shielding. The contacts feature an innovative alignment guide that enables proper connection of each channel without any additional insertion force being required. This feature lowers the risk of damage, resulting in increased reliability and lifetime of the backplane. The contacts also feature a unique “positive stop” feature that ensures that the contacts are inserted properly and do not overheat, increasing the life of the connector. The metal housing also helps to protect the contacts and reduce crosstalk between channels, increasing the overall performance of the connector.

The 10104997-V0C-60B backplane connector is a versatile, high-performance product from TE Connectivity that can be used in a variety of applications. It can be used for board-to-board interconnects in data centers, storage systems, embedded computing, automotive electric/electronic systems, server architectures, process control systems, and many more. It’s particularly well-suited for application with high bandwidths and electrical noise, such as those found in data centers and other telecommunications equipment.

The 10104997-V0C-60B backplane connector can also be used in medical device designs that demand high performance, reliability and operational safety. It can be implemented in medical implants, vital signs monitoring systems, robotic surgery, magnetic resonance imaging systems and more, due to its superior performance and high level of reliability.

TE Connectivity’s 10104997-V0C-60B backplane connectoris a specialized, high-performance product that offers superior performance and reliability in a variety of environments and applications. It features an innovative contact arrangement, a unique alignment guide, and a metal housing that provides EMI/RFI shielding. This combination of features makes it an ideal solution for applications requiring robust and reliable interconnects that can perform at high data rates and resist electrical noise and other interference.

The specific data is subject to PDF, and the above content is for reference

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