10104999-00E-30DLF Allicdata Electronics
Allicdata Part #:

10104999-00E-30DLF-ND

Manufacturer Part#:

10104999-00E-30DLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: XCEDE 2W 6PVH 8COL
More Detail: N/A
DataSheet: 10104999-00E-30DLF datasheet10104999-00E-30DLF Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: 8
Voltage Rating: --
Operating Temperature: -55°C ~ 85°C
Material Flammability Rating: UL94 V-0
Current Rating: --
Color: Gray
Contact Finish Thickness: 15.0µin (0.38µm)
Contact Finish: Gold
Features: --
Contact Layout, Typical: 72 Differential Pairs
Termination: Press-Fit
Mounting Type: Through Hole
Series: XCede®
Number of Rows: --
Pitch: --
Number of Positions Loaded: All
Number of Positions: --
Connector Style: XCede®
Connector Type: Header, Male Pins and Blades
Connector Usage: Backplane
Moisture Sensitivity Level (MSL): --
Part Status: Active
Lead Free Status / RoHS Status: --
Packaging: Tray 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane connectors are specialized devices that provide the connection and transmission of signals and power between modules, cards, slots, and other parts of a chassis backplane. The specific type of backplane connector, 10104999-00E-30DLF, is a specialized and high-performance type that is used for power distribution, signal transmission, and data routing within high-performance systems.This article will explain the 10104999-00E-30DLF application field and working principle. The 10104999-00E-30DLF is widely used in numerous application fields, such as data centers, test systems, communications, aerospace, industrial automation, medical, automotive, military, and industrial design and products. The connector is designed to meet the needs of a variety of applications in terms of size, performance, and multiple support.The 10104999-00E-30DLF is a high-density, high-performance connector designed to provide a reliable connection and efficient data transfer in the most demanding environments. The connector is made of a high-temperature dielectric material that provides excellent electrical characteristics. It is designed to meet the IEEE 802.3, IEEE 802.3af, and IEEE 802.3at standards. It is also designed to meet environmental conditions, including temperature, shock, and vibration.In order to ensure reliable and efficient operation of the 10104999-00E-30DLF, the connector is designed with several features. The features include column cable supports for high insertion force, wide contact area for high contact counts, and improved signal integrity. The connector also has multi-level shielding which provides improved EMI/RFI performance. In addition, the connector is resistant to corrosion and oxidation and is capable of withstanding temperatures from -55°C to +125°C.The 10104999-00E-30DLF is also designed to provide efficient and reliable signal transfer between modules, cards, slots, and other parts of a chassis backplane. The connector has a wide variety of features that allow it to be used in any type of system. For example, the connector has a multi-layer flex construction for high-speed signal transfer, a wide range of operating frequencies, and EMI/RFI rejection capabilities.The working principle of the 10104999-00E-30DLF can be summarized as follows:The connector is designed with an array of contacts on one side and a ground layer on the other side. When the two sides of the connector are mated, they create an interconnection that allows signals to be transferred between the contact points. The signal is then transferred through the ground layer and finally to the contact area. As the signal is transmitted across the connector, it is shielded by the contact area, which also helps to reduce EMI/RFI noise.The 10104999-00E-30DLF is a specialized and high-performance backplane connector designed to provide reliable and efficient data transfer in demanding applications. It is widely used in numerous application fields and is designed to meet the IEEE 802.3 standards. The connector features multiple layers of shielding for improved EMI/RFI performance, high-temperature dielectrics, and a wide range of operating frequencies. The working principle of the connector is based on the array of contacts on one side and a ground layer on the other side which allows for signal transmission between contact points and efficient signal transfer.

The specific data is subject to PDF, and the above content is for reference

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