10106139-8003003LF

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10106139-8003003LF is a specialized backplane connector system of high density, high speed data transmission needed in high-performance computing, bandwidth device and mobile device applications, and is designed for the harsh environments of complex printed circuit board to printed circuit board interconnections.

The latest version of this specialized backplane connector technology has been developed for a wide range of applications, including, but not limited to: mobile devices, Ethernet, server chassis and high-performance computing.

This highly reliable and cost-effective solution provides cleaner connections than traditional connectors and is designed for easy thermal migration. It uses a high-quality unmodified goldplated copper lead frame material for a lifetime connection and the pins are surrounded by six unique rubbery points with an extremely low insertion force.

The dense backplane connector system offers 14 vertical and 8 horizontal shielded contacts in a 2mm x 2mm x 8mm package size with a rated current of 3A per contact and working frequency up to 6Ghz. It features 0.2mm pin pitch with 5.5mm board-to-board stacking height. It complies with the ROHS and REACH directives and provides a reliable and durable connection.

The industry-leading performance of the 10106139-8003003LF backplane connector is created using advanced design & manufacturing capabilities that avoid potential stray damaged caused by trace side pushouts. The low-profile design also provides space savings inside the board stack-up and simplifies the board-to-board connections by providing more consistent stack-up heights.

The working principle of this backplane connector system lies in the “push and pull” principle, where contacts are inserted and locked inside the board by means of a simple pushing action. When the connection is generated, a spring actuator provides a locking force between the contact and the board surface to protect it from insertion forces. The connector itself also helps reduce EMI (electromagnetic interference) by screening and containing both electric fields and magnetic fields.

The 10106139-8003003LF is a specialized backplane connector system designed specifically for high-performance computing, bandwidth devices and mobile device applications, and utilizes the latest cutting-edge technologies to ensure highly reliable and cost-effective connections. It can provide a lifetime connection and features a very low insertion force, allowing for easy thermal migration and a quieter board-to-board connection.

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