10114831-10102LF Allicdata Electronics
Allicdata Part #:

10114831-10102LF-ND

Manufacturer Part#:

10114831-10102LF

Price: $ 0.11
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: WTB 1.25 WAFER 90 DIP
More Detail: Connector Header Through Hole, Right Angle 2 posit...
DataSheet: 10114831-10102LF datasheet10114831-10102LF Datasheet/PDF
Quantity: 1000
3000 +: $ 0.09475
Stock 1000Can Ship Immediately
$ 0.11
Specifications
Operating Temperature: -40°C ~ 105°C
Insulation Height: 0.138" (3.50mm)
Contact Shape: Rectangular
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: --
Contact Finish - Post: Tin
Contact Material: Phosphor Bronze
Insulation Material: Liquid Crystal Polymer (LCP)
Features: --
Overall Contact Length: --
Ingress Protection: --
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Current Rating: 1A
Voltage Rating: 125V
Mated Stacking Heights: --
Contact Finish Thickness - Post: --
Applications: --
Number of Positions Loaded: All
Packaging: Tape & Reel (TR) 
Part Status: Active
Connector Type: Header
Contact Type: Male Pin
Pitch - Mating: 0.049" (1.25mm)
Number of Positions: 2
Number of Rows: 1
Row Spacing - Mating: --
Series: 10114831
Style: Board to Cable/Wire
Shrouding: Shrouded - 4 Wall
Mounting Type: Through Hole, Right Angle
Termination: Solder
Fastening Type: Detent Lock
Contact Length - Mating: --
Contact Length - Post: 0.079" (2.00mm)
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Rectangular Connectors – Headers, Male Pins offer many benefits for various applications, and the 10114831-10102LF is no exception. This pin and header set is designed to meet the high requirements of integrated circuit (IC) systems and provide a reliable, secure connection. This article will discuss the various application fields and working principle of the 10114831-10102LF.

The 10114831-10102LF is a reliable and secure connection option solution featuring gold surface finishes ideal in high-current/high-temperature operation. It features an attractive body and provides excellent performance for IC packaging. It is best suited for use in automotive, telecommunications, and computing applications.

The 10114831-10102LF is designed to help reduce size and weight, as well as improve electrical and thermal efficiency within various systems. There are several sizes, body heights, and contact styles to choose from. The male pins have compression-fit connection technology and are suitable for secure mounting with low-resistance interconnects. The easy assembly and disassembly makes it easy to install, remove, and maintain.

The advantages of utilizing the 10114831-10102LF include efficient thermal relief, back-plating, pressure contact, and enabler to reduce current impedance. The pin and header connection system has a low profile design that helps to reduce space usage and increases the transmission rate. It also provides robust wire-to-board connectivity.

The 10114831-10102LF headers and pins are able to withstand high temperatures and still offer stable performance. The device is rated for operating temperatures up to 85°C and can handle up to 15A. The gold-plated contact area provides additional corrosion resistance and long-term reliability. It is also designed to provide enhanced mechanical and electrical performance.

The 10114831-10102LF also utilizes the Direct Cavity Coupling (DCC) technique, which involves either the source or substrate being placed in direct contact with the connection point. This eliminates the need for extra wires, increasing the system’s efficiency. The point-to-point connection method also ensures direct contact between the components for improved heat dissipation.

Overall, the 10114831-10102LF is an ideal choice for many applications. It is a reliable and secure connection option that is designed to meet the high requirements of various IC systems. The pin and header connection system has a low profile design that helps to reduce size and weight and improve electrical and thermal efficiency. With its performance features, the device can offer robust wire-to-board connectivity and is able to withstand high temperatures and still offer stable performance.

The specific data is subject to PDF, and the above content is for reference

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