10AS066N3F40I2SGES

Series:	Arria 10 SX
Packaging:	Tray
Part Status:	Discontinued at Digi-Key
Architecture:	MCU, FPGA
Core Processor:	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:	--
RAM Size:	256KB
Peripherals:	DMA, POR, WDT
Connectivity:	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:	1.5GHz
Primary Attributes:	FPGA - 660K Logic Elements
Operating Temperature:	-40°C ~ 100°C (TJ)
Package / Case:	1517-BBGA, FCBGA
Supplier Device Package:	1517-FCBGA (40x40)
Number of I/O:	588

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Introduction to Embedded System On Chip (SoC)

Embedded System On Chip (SoC) is a technology that has become increasingly popular in recent years. The term refers to an integrated circuit that contains all the components necessary to perform a specific task or function. An SoC is often referred to as a "system on a chip" because it includes all the necessary components, such as processors, memory, power management, and other peripherals, on one piece of silicon. This makes it much more efficient and cost-effective than traditional computing solutions.

What is 10AS066N3F40I2SGES?

10AS066N3F40I2SGES or "System on Chip (SoC) with SIS Technology" is a technology developed by Advanced Micro Devices (AMD). It stands for System on Chip (SoC) with Simultaneous Inversion of Signal (SIS). The technology enables the integration of many components onto one chip, thus reducing the size and cost of the system. 10AS066N3F40I2SGES is based on AMD\'s patented SIS (Simultaneous Inversion of Signal) technology which allows for quicker and wider signal control. The core of the solution is AMD\'s Bulldozer architecture, a x86-64 based core that can handle multiple threads simultaneously.

Applications and Benefits

The 10AS066N3F40I2SGES is ideal for applications that require multiple cores or tasks running at once. It is ideal for embedded systems, robotics, surveillance, data centers, and other tasks that have high data computation requirements. Embedded systems can benefit significantly from the 10AS066N3F40I2SGES as it helps to reduce their size and complexity. This technology can also help reduce power consumption and increase overall performance.Thanks to the SIS technology, the 10AS066N3F40I2SGES can support up to 16 cores and 256 threads simultaneously. This allows for fast and efficient data computation, making this technology ideal for data-intensive applications. As mentioned earlier, the chip is also power efficient, reducing power consumption and allowing for longer battery life in mobile devices.

Working Principle

The working principle of 10AS066N3F40I2SGES revolves around the SIS (Simultaneous Inversion of Signal) technology. This technology enables the integrated circuit to quickly switch from one signal inversion to another. This is achieved by the use of a signal inverter with a programmable offset. This allows for quick and accurate signal control, allowing for faster signal processing.The SIS architecture also provides the necessary signal control for multiple cores and threads to run simultaneously. For each core, the signal is processed differently, taking advantage of the inverted signals. This allows each core and thread to run in parallel, increasing the overall performance of the system.

Conclusion

The 10AS066N3F40I2SGES is a powerful technology made possible by AMD\'s patented SIS (Simultaneous Inversion of Signal) technology. It provides an integrated circuit solution that is power efficient and allows for faster signal processing. The technology is ideal for embedded systems, robotics, surveillance, data centers, and other tasks that have high data computation requirements. Thanks to the SIS technology, the 10AS066N3F40I2SGES can support up to 16 cores and 256 threads simultaneously, allowing for maximum efficiency and performance.

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