120954-4 Allicdata Electronics
Allicdata Part #:

120954-4-ND

Manufacturer Part#:

120954-4

Price: $ 4.28
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN R/A PLUG 4P
More Detail: N/A
DataSheet: 120954-4 datasheet120954-4 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1 +: 4.28000
Stock 1000Can Ship Immediately
$ 4.28
Specifications
Series: UPM (Universal Power Modules)
Packaging: Bulk 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: Backplane
Connector Type: Header, Male Blades
Connector Style: Blade Power
Number of Positions: 4
Number of Positions Loaded: All
Pitch: --
Number of Rows: 1
Number of Columns: --
Mounting Type: Board Edge, Through Hole, Right Angle
Termination: Press-Fit
Contact Layout, Typical: 4 Power
Features: Board Guide
Contact Finish: Gold or Gold-Palladium
Contact Finish Thickness: --
Color: Gray
Current Rating: --
Material Flammability Rating: UL94 V-0
Operating Temperature: -55°C ~ 125°C
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane connectors are vital components in the electronic assembly industry, especially in large-scale system architectures such as servers and high-speed data centers. The 120954-4 backplane connector is a specialized type, designed specifically to simplify the engineering challenge of making interconnections between a wide variety of system boards. As the next generation of backplane connectors, it is optimized for high-speed data transfer and passing peak current through multiple contact pins.

Structure and Specifications

The 120954-4’s structure consists of a twin-beam pin system connected to a customized housing. This customized pin system has a pitch of 0.079 inch and a height of 0.364 inches, allowing it to be used in tightly packed, high-speed systems successfully. It features an exclusive insulating flange that connects between the twin beams which ensures fast engagement and disconnection between the pins and the board. The contact pins themselves are designed for maximum current passing and minimum signal degradation, with a maximum contact pressure of 168g. This affords unprecedented performance for operations involving data rates up to 5Gbps and transient currents up to 50A.

Applications and Working Principle

The 120954-4 is well-suited for board-to-board applications such as high-speed data centers, high-end servers, industrial automation products, avionics, and aerospace systems. Its twin-beam pin system provides a reliable and easy-to-use connection for making interconnections between cards and boards. The contact pins are designed to transfer data quickly and reliably, while also enabling the pins to pass high current through each point of contact. Through this combination of features, the 120954-4 provides secure and dependable communication for the most demanding applications.

In operation, the specialized housing slides the contact pins into the printed circuit board. Once in place, a latching mechanism locks the pins in place, maximizing contact pressure and reliability. In addition, the twin-beam design offers several electrostatic discharge and thermal flow paths, helping to safely dissipate any excess energy during operation. This ensures that any data signals transmitted or received through the board remain uncorrupted.

Conclusion

The 120954-4 backplane connector is an all-in-one solution for a wide variety of board-to-board applications demanding high-speed data transfer and up to 50A transient current. With a specialized housing design and twin-beam pin system, this connector provides reliable operation, while also affording superior signal integrity and thermal management. This makes the 120954-4 the perfect choice for applications requiring the utmost in board-to-board signal and power integrity.

The specific data is subject to PDF, and the above content is for reference

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