121687_REV1

Series:	--
Part Status:	Active
Type:	Heat Pipe
Package Cooled:	--
Attachment Method:	--
Shape:	Round
Length:	3.937" (100.00mm)
Width:	--
Diameter:	0.157" (4.00mm) OD
Height Off Base (Height of Fin):	--
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	--
Material:	Copper
Material Finish:	--

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Introduction

The 121687_REV1 Thermal - Heat Sinks enable efficient cooling of electronic components. It offers optimum performance in a wide range of applications with the flexibility to accommodate different sizes of components. These heat sinks are cost-effective solution and a high-quality product with small design and easy installation.

Application Fields

The 121687_REV1 Thermal - Heat Sinks are suitable for numerous applications, including laser systems, dimming systems, Power Supplies, Automation and Control and other industrial applications. It is specifically designed to handle high heat loads, including complex and large components. It is used in many applications such as servers, CPUs and GPUs, motor controllers, FPGAs, ASICs, and medical equipment. The 121687_REV1 Thermal - Heat Sinks are certified to UL and TUV standards.

Features and Benefits

The 121687_REV1 Thermal - Heat Sinks have several key features, which make it a great thermal solution for high-power electronics. These features are listed below:* Compact Design: The 121687_REV1 Thermal - Heat Sinks have a low profile design, which allows it to fit tightly and easily in confined spaces.* Fine-tuning Capabilities: This enables users to adjust the amount of heat dissipated by adjusting the airflow within the sink.* Highly durable: The 121687_REV1 Thermal - Heat Sinks are constructed using advanced materials that are resistant to temperature extremes, as well as mechanical and chemical damage.* High heat load capacity: The 121687_REV1 Thermal - Heat Sinks can handle a higher heat load than other comparable products, allowing greater levels of efficiency.* Optimized cooling: The 121687_REV1 Thermal - Heat Sinks has a large surface area to ensure efficient dissipation of heat.

Working Principle

The 121687_REV1 Thermal - Heat Sinks work by dissipating the heat generated by an electronic component to the surrounding air. The heat is moved from the component to the sink surface using convection, the natural circulation of air caused by the difference in temperature between the surface of the sink and the surrounding air. As the air warms up, it rises, carrying the heat away from the component. The warmed air is then replaced by cooler air from the sides of the sink, allowing the process to repeat. This process creates a cooling effect that keeps the components cooler and reduces the risk of damages to them.The 121687_REV1 Thermal - Heat Sinks also emits noise from the fan, which is an important factor to consider when choosing a cooling solution. The fan size and speed should be selected based on the size and heat output of the component, as well as the desired level of noise output.

Conclusion

The 121687_REV1 Thermal - Heat Sinks provide an efficient cooling solution for high power electronic components. It is a highly durable, compact and easy-to-install product, making it an ideal choice for numerous applications. With optimized cooling, a fine-tuning capability and high heat load capacity, the 121687_REV1 Thermal - Heat Sinks is the perfect choice for a wide range of thermal management requirements.

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