121688_REV1 Allicdata Electronics
Allicdata Part #:

345-1437-ND

Manufacturer Part#:

121688_REV1

Price: $ 8.16
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATPIPE SINTERED 4MMX150MM
More Detail: Heat Sink Copper Heat Pipe
DataSheet: 121688_REV1 datasheet121688_REV1 Datasheet/PDF
Quantity: 388
1 +: $ 7.42140
10 +: $ 7.00938
25 +: $ 6.59711
50 +: $ 6.18484
100 +: $ 5.77250
250 +: $ 5.36019
500 +: $ 5.25711
1000 +: $ 5.15403
Stock 388Can Ship Immediately
$ 8.16
Specifications
Series: --
Part Status: Active
Type: Heat Pipe
Package Cooled: --
Attachment Method: --
Shape: Round
Length: 5.906" (150.00mm)
Width: --
Diameter: 0.157" (4.00mm) OD
Height Off Base (Height of Fin): --
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Copper
Material Finish: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

The 121688_REV1 is a type of heat sink device, slated to replace traditional ways of cooling a system, like using a fan. Heat sinks are designed to dissipate heat, usually from hot ends or components like processors and graphics cards. A heat sink creates a cool environment for a system, making it more efficient and reliable.

A heat sink typically uses a base made out of metal like aluminum or copper. To increase its thermal efficiency, heat sink manufacturers use fin shapes or designs to dissipate heat away from the hot area and beyond the chip or component. Heat is absorbed by metal fins that absorb the heat from the chip and direct it away from the system. Thermal interface materials like heat sinks and fans are used to cool the system further.

The 121688_REV1 application field includes cooling high performance chips such as graphics cards, CPUs and FPGAs. It is more reliable than other cooling methods, due to its high thermal conductivity. This type of heat sink employs a tapering fin design, which improves its effectiveness in dissipating heat away from the component or chip. This tapering helps direct the heat away from the surface and increases the speed with which the heat is dissipated. It can also be used in the general air-cooled system, if the ambient temperature is not too high or too low.

The working principle of the 121688_REV1 heat sink involves transferring heat away from the surface of the component or processor. This is usually accomplished by using a combination of heat pipes and metal fins. The heat pipes act as conduits, moving thermal energy from one point to another, and the metal fins help to distribute heat away from the component. In order for the heat sink to function efficiently, it requires a thermal environment, which should be neither too hot or too cold.

In summary, the 121688_REV1 is a type of heat sink device designed to reduce the temperature of components and chips. It works by using metal fins that absorb heat and direct it away from the component. This tapering effect increases the speed with which the heat is dissipated. Heat pipes improve the efficiency of heat transfer and a thermal environment is required for the heat sink to function. This type of heat sink has the potential to reduce cooling costs and increase reliability of components and systems.

The specific data is subject to PDF, and the above content is for reference

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