122262 Allicdata Electronics

122262 Fans, Thermal Management

Allicdata Part #:

345-1471-ND

Manufacturer Part#:

122262

Price: $ 67.92
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK 19152 PROFILE 12"
More Detail: Heat Sink Power Modules Aluminum Top Mount
DataSheet: 122262 datasheet122262 Datasheet/PDF
Quantity: 1
1 +: $ 61.74630
10 +: $ 57.88760
25 +: $ 54.02830
50 +: $ 52.09860
100 +: $ 50.16910
Stock 1Can Ship Immediately
$ 67.92
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: Power Modules
Attachment Method: Adhesive
Shape: Rectangular, Fins
Length: 12.000" (304.80mm)
Width: 12.250" (311.15mm)
Diameter: --
Height Off Base (Height of Fin): 1.000" (25.40mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Unfinished
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-heat sinks are a critical part of the modern electronic device ecosystem. They play a key role in providing thermal management for devices operating at high temperatures. The 122262 thermal-heat sink is a particularly effective tool for this purpose due to its excellent heat transfer capabilities. A quick overview of its application field and working principle will be helpful in understanding its value in the world of electronics.

The 122262 thermal-heat sink is designed for applications such as heavy-duty electronics and medical equipment. It is a powerful tool for reducing the overall heat generated by electronic circuits, and is especially valuable in mobile devices where cooling is an especially vital concern. The 122262 thermal-heat sink works by utilizing an array of fins that are connected to a central heat sink base. As air passes through the fin array, heat is absorbed from the device and conducted into the fins, and then dissipated into the surrounding environment.

Heat transfer is greatly enhanced by the uniform fin width and length, as well as the optimally designed cross-sectional area. This ensures maximum heat transfer effectiveness by transferring heat away from the device while dissipating it into the atmosphere as quickly as possible. The heat sink’s performance can be further improved by adding a fan to the assembly. The fan helps to quickly draw in outside air and forces it through the fin array. This is the most effective way to ensure maximum heat transfer and optimal performance.

The 122262 thermal-heat sink also has many other advantages, such as a high level of durability. The device is constructed from quality materials, ensuring a long life of service. It also boasts excellent corrosion resistance capabilities, ensuring a product that is built to last even through harsh environmental conditions. Additionally, the 122262 thermal-heat sink is also extremely cost-effective when compared to other models of the same size, making it an essential option in many applications.

The combination of great performance and long-term durability makes the 122262 thermal-heat sink a great choice for any electronics project. The device’s efficient heat transfer capabilities make it especially attractive for use in complex mobile applications, where cooling is a major concern. Furthermore, its low cost makes it an accessible option even for those on a budget. With so many benefits, it’s no wonder why the 122262 thermal-heat sink has become an essential component in the modern electronics industry.

The specific data is subject to PDF, and the above content is for reference

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