124681 Allicdata Electronics
Allicdata Part #:

345-1680-ND

Manufacturer Part#:

124681

Price: $ 10.13
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: ROUND HEATPIPE 12X600MM 30W
More Detail: N/A
DataSheet: 124681 datasheet124681 Datasheet/PDF
Quantity: 1000
1 +: $ 9.11610
10 +: $ 8.61021
25 +: $ 8.10383
50 +: $ 7.59745
100 +: $ 7.09093
250 +: $ 6.58444
500 +: $ 6.45781
Stock 1000Can Ship Immediately
$ 10.13
Specifications
Series: --
Part Status: Active
Type: Heat Pipe
Attachment Method: --
Shape: Round
Length: 23.622" (600.00mm)
Width: --
Height: --
Diameter: 0.472" (12.00mm) OD
Material: Copper
Weight: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Thermal-heat sinks are commonly used in a variety of applications to help dissipate and absorb heat generated by electronic components. Their primary purpose is to ensure that heat is diverted away from sensitive components, ensuring their thermal performance and therefore their reliability. As such, thermal-heat sinks are an important part of the heat dissipation and management system within any electronic system.

The most common type of thermal-heat sink is the one-piece extruded aluminum heat sink. This kind of heat sink is made from a solid, extruded aluminum block which has been machined to create gripping planes for the components. The extrusion process gives the aluminum an excellent heat conductivity of up to 200 times greater than other materials. Due to its large surface area, the extruded aluminum heat sink can help dissipate heat quickly, and its lightweight form helps to reduce the overall weight of the electronics assembly.

In addition to the extruded aluminum version, thermal-heat sinks also come in other materials, including copper, plastics and alloys. They also come in different shapes and sizes, depending on what is needed for the application. The design of these sinks must be carefully considered, as the thermal performance of the solution will depend heavily on the composition, size and shape of the sink.

When designing a thermal-heat sink solution, the designer must consider several factors such as the thermal conductivity of the material, the surface area of the sink and the total volume of the sink itself. The total volume of the sink should be chosen based on the number of components it needs to cool, as well as the amount of heat it needs to absorb. The surface area of the sink will determine how much heat can be dissipated, while the thermal conductivity of the material will determine how quickly heat can be dissipated.

In some cases, thermal-heat sinks may also require additional components in order to improve the system\'s performance. This may include fans, or even water blocks, to help ensure the correct amount of heat is dissipated. Additionally, special materials may be needed to provide additional thermal insulation. Additionally, thermal insulation may be necessary if the system operates in high temperature environments.

In addition to cooling electronics, thermal-heat sinks can also be used in other applications. For example, they can be used in medical applications to regulate temperature within high-tech medical equipment, in aerospace applications to cool the delicate components of an aircraft, and in industrial applications to dissipate heat in large metalworking machinery. In each application, the features of the thermal-heat sink must be considered, as these features will determine its effectiveness.

In conclusion, 124681 application field and working principle is not only important in the electronics world but also in a variety of other fields. The basic design of the thermal-heat sink is fairly simple, but its features need to be carefully considered in order to ensure its performance. Once properly designed, the thermal-heat sink can help ensure optimal performance in its application.

The specific data is subject to PDF, and the above content is for reference

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