
Allicdata Part #: | 1322XEVK-SFTW-ND |
Manufacturer Part#: |
1322XEVK-SFTW |
Price: | $ 2.77 |
Product Category: | RF/IF and RFID |
Manufacturer: | NXP USA Inc |
Short Description: | KIT EVAL 1322X BEESTACK/IAR 256K |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 2.52000 |
Series: | -- |
Part Status: | Obsolete |
Type: | Transceiver; 802.15.4 (ZigBee®) |
Frequency: | 2.4GHz |
For Use With/Related Products: | MC1322x |
Supplied Contents: | Board(s) |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
RF Evaluation and Development Kits, Boards are essential for engineers to efficiently develop, test, and troubleshoot Wireless products. However, the purpose and particular functions of the kits depend highly on the design of the particular development board.
1322XEVK-SFTW is a comprehensive kit specially designed for evaluation and development projects of Certified Wireless Smartphone Platforms as per GCF requirements. It helps in efficient troubleshooting, offering rapid prototyping to test the integration of multiple cellular and other wireless technologies.
Application Field of 1322XEVK-SFTW
1322XEVK-SFTW is a suitable platform for certification and development of cellular-connected devices. The development kit is especially beneficial for applications related to IoT, smartphone, or remote Internet over cellular. It can extensively be used in OBD2 applications for vehicles. This board can also be applied to automotive data collection, networking, and other industrial applications relating to wireless and cellular technology.
Working Principle of 1322XEVK-SFTW
1322XEVK-SFTW basically includes the QorIQ P3226 Fleet Network Processor with the PowerQUICC technology for controlling multiple communications pathways and support for latest packaging efficiency. The middleware solutions are offered to help developers in instances of evaluation or development. It basically supports 3G/4G and other wireless technologies such as Bluetooth, fiber optics, Wi-Fi, and ZigBee and requires single 5V power source for powering the board.
The board includes six GPPs namely, one FSL P3226 and five ARM Cortex A5 cores, which enables advanced multi-core networking applications. There are four C66x cores supported by the core Pac Multicore DSP for real-time computationally intensive tasks. For supporting advanced communications systems, the board also has four USB 2.0 ports, two MII ports, and four CSI ports with connectivity for external data storage.
The development kit supports seven different modems, which include LTE Cat 4/ Cat 6/ Cat 12/ Cat 13, WCDMA, TD-SCDMA, EDGE, EV-DO and HSPA modem technologies. Developers can also validate their systems on two FIST connectors, which helps them in reconfiguring the optional cards.
1322XEVK-SFTW supports a smart debugging tool called CXEDE and offers automated power management. The power management is done by using power optimized subsystems and components, with incorporated technologies such as USB 2.0 PHY for low power. That reduces the cost of the overall system and also helps in the optimization of the power supply.
The 1322XEVK-SFTW also comprises of X-ES BSP services such as ETC – BSP Software Package, drivers, Linux OS, and an integrated development environment (QMomentics). By having all these components build into one kit, the 1322XEVK-SFTWallows faster development cycles, more efficient operation,and, ultimately, simpler validation.
The specific data is subject to PDF, and the above content is for reference
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