1743419-1

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The 1743419-1 Connector is a small form factor two part mating system designed for high density signal and power applications. It is available with a 1.27mm x 1.27mm pitch and is designed to utilize eye-of-the-needle, solder or crimp contact technology while saving space on the printed circuit board. It is part of the TwinCat® family of connectors from TE Connectivity.

Application Field of 1743419-1

This connector system is designed to address high density applications such as in datacenter and cloud applications. Its 1.27mm x 1.27mm pitch offers an extreme density while allowing more than 300 mixed power and signal contacts to be placed in a single connector. It is ideal for power and signal applications in computer backplanes, network switches, routers, storage servers, power supplies and other applications in high density boards.

The number of contacts and the system’s flexibility with both power and signal connections makes the 1743419-1 perfect for the demands of high-speed applications. The system also meets the latest SAE Forgeline ARP5503 aerospace requirements, and meet EMI and RFI shielding requirements.

1743419-1 Components

The 1743419-1 Connector operates with two components, the housing and the plug. The housing provides a secure and reliable connection of the backshell, cable or tube to the connector, while the plug provides the secure connection to the board. The system utilizes modular housings and plugs, which enable the use of a variety of cable, sleeve and terminal connectors as well as channel and plug connectors for board mounting.

The connector also includes a variety of housings and boots that can be used to cover the ends of the connector for added insulation, corrosion protection and greater protection against water and dust. This makes the 1743419-1 well suited for environmentally harsh applications.

1743419-1 Working Principle

The 1743419-1 Connector system operates using a two part mating system. The two parts, the housing and the plug, operate by mating the contacts into a reliable connection with a good mating force. The contact force is maintained by a tension band that is released and retracted to engage and disengage the housings and plug.

The housing and plug also feature a high degree of interference by utilizing Teflon inserts that keep the contact firmly seated in the connectors. This feature is designed to help eliminate any potential electrical contact corrosion.

The system is also designed to minimize any signal loss with Teflon insulation and optimizing contact geometry. The contacts also feature a rugged thermoplastic shell for improved performance and reliability.

Conclusion

The 1743419-1 Connector system from TE Connectivity is a small form factor, two part mating system designed for high density signal and power applications. It uses a 1.27mm x 1.27mm pitch and features a high degree of interference and optimized contact geometry for better signal integrity. It is also designed with a variety of housings and boots for added insulation, corrosion protection and greater protection against water and dust. This makes it ideal for applications in datacenter and cloud applications, computer backplanes, network switches, routers, storage servers, power supplies and other high density boards.

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