1963783-2 Allicdata Electronics
Allicdata Part #:

1963783-2-ND

Manufacturer Part#:

1963783-2

Price: $ 5.35
Product Category:

Fans, Thermal Management

Manufacturer: TE Connectivity AMP Connectors
Short Description: QSFP DOUBLE SAN HEATSINK 6.5MM
More Detail: Heat Sink
DataSheet: 1963783-2 datasheet1963783-2 Datasheet/PDF
Quantity: 1000
1320 +: $ 4.81015
Stock 1000Can Ship Immediately
$ 5.35
Specifications
Series: *
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal solutions have become increasingly critical components of modern electronic systems. A variety of technologies are available, but the most popular of all is the application of heat sinks. Thermal heat sinks can be used to regulate temperature by dissipating heat, ensuring the desired temperature is maintained, without mitigating the performance of the electronics. The versatile application of the heat sink is reflected in the range of ratings such as 1963783-2, which is an all-in-one solution for the thermal management of various electronic systems.

The 1963783-2 thermal heat sink is specifically designed to address the thermal management needs of small-scale electronics. It features a copper base which provides efficient thermal transfer from the heat source to the heat sink, and comes with a cooling fan for additional cooling ability. The fan offers adjustable speed control for optimal thermal management. The aluminum fins of the heat sink offer optimized surface area for maximum surface contact with the air to help dissipate the generated heat. The entire setup is lightweight yet durable, making it an ideal choice for applications in which size and weight are significant factors.

The 1963783-2 thermal heat sink is primarily intended for use in consumer electronics, such as gaming consoles, laptop computers, and other small form-factor devices. It offers excellent thermal protection for a wide range of temperatures, from 0 to 140°C. In addition, the heat sink is compatible with a variety of heat sources, from CPUs, GPUs, and other small-scale components.

The way in which a 1963783-2 thermal heat sink works is based on the principles of thermal conduction and convection. Thermal conduction is the transfer of heat through a solid medium, such as the copper base of the heat sink. The transfer of heat occurs when heat energy from the heat source is transferred to the cooler heat sink. Convection, on the other hand, is the transfer of heat through a gas or liquid medium. As the fan of the heat sink is running, it circulates air around the aluminum fins, creating a steady stream of cooler air that dissipates the generated heat effectively.

The 1963783-2 meet industry standards for performance and safety, and is UL-certified for its quality and reliability. Its compact design and cost-effective price make this an ideal choice for system integrators and manufacturers who are looking for an affordable and reliable solution for their thermal management needs.

The specific data is subject to PDF, and the above content is for reference

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