1963856-1

Series:	--
Part Status:	Active
Type:	Board Level
Package Cooled:	SMD
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	3.181" (80.80mm)
Width:	4.390" (111.50mm)
Diameter:	--
Height Off Base (Height of Fin):	0.404" (10.27mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks: 1963856-1 Application Field and Working PrincipleThermal - Heat Sinks are used in a variety of industries due to its ability to effectively transfer heat away from a component or device. It is used to cool and eliminate heat from electronic components, such as CPU\'s and other components. A thermal - heat sink is a heat exchanger that is used to prevent excessive heat from damaging electronic and non-electronic components.In this article, we will discuss the application field and working principle of the 1963856-1 thermal - heat sink device. This device is made with a large-scale copper base and heat dissipating fins. It is designed to be installed in a variety of places, such as a SERVER machine, computer CPU, or a high-end GPU.The 1963856-1 thermal - heat sink\'s application field is mainly for cooling down high-end electronic components such as CPU, GPU, and other hardware components. As mentioned above, it is installed in a variety of places, such as a SERVER machine, computer CPU, or a high-end GPU. This is due to the fact that the device is designed to dissipate heat quickly and efficiently.The working principle of the thermal - heat sink device is simple yet effective. It uses the basic concept of convection in order to dissipate excess heat. The large-scale copper base of the device contains many fins, which are spaced at a certain distance. As the heat energy is generated by the component, it is absorbed by the copper base and then radiated off into the surrounding air or environment by the heat dissipating fins.This process of convection temperatures down the surrounding air while simultaneously reducing the temperature of the device and the component. As a result, the component is able to run at a more efficient pace without experiencing too high of a temperature. This helps to reduce energy wastage and improve the performance of the component as well.The 1963856-1 thermal - heat sink device can also be used to reduce the thermal energy generated by motors and other machine components. It helps to reduce the levels of heat generated by the motor, which can be quite a dangerous problem if left unattended.In conclusion, the 1963856-1 thermal - heat sink device is a great product that is used in many different industries. It is designed to reduce heat energy produced by electronic components such as the GPU and CPU, as well as motors and other machine components. Through the use of convection, the device is able to effectively transfer heat away from a component or device while maintaining the optimal temperature for optimal performance.

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