2013289-2 Connectors, Interconnects |
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Allicdata Part #: | A121580-ND |
Manufacturer Part#: |
2013289-2 |
Price: | $ 4.24 |
Product Category: | Connectors, Interconnects |
Manufacturer: | TE Connectivity AMP Connectors |
Short Description: | CONN SKT SODIMM 204POS SMD |
More Detail: | 204 Position SODIMM DDR3 SDRAM Socket Surface Moun... |
DataSheet: | 2013289-2 Datasheet/PDF |
Quantity: | 8447 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
1 +: | $ 3.85560 |
10 +: | $ 3.69495 |
25 +: | $ 3.37378 |
50 +: | $ 3.21300 |
100 +: | $ 3.05235 |
250 +: | $ 2.73105 |
500 +: | $ 2.57040 |
1000 +: | $ 2.24910 |
2500 +: | $ 2.13665 |
Series: | -- |
Packaging: | Tray |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Connector Style: | SODIMM |
Number of Positions: | 204 |
Memory Type: | DDR3 SDRAM |
Standards: | -- |
Mounting Type: | Surface Mount, 25° Angle |
Features: | Board Guide, Latches |
Mounting Feature: | Normal, Standard - Top |
Contact Finish: | Gold |
Contact Finish Thickness: | 10.0µin (0.25µm) |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Memory Connectors, or Inline Module Sockets, are designed to provide high-density connector solutions for today\'s demanding memory applications. They offer multiple configurations including board-to-board, card-to-card and chip-to-board connections. These high-density connectors provide optimal performance for system designs where space optimization and dynamic memory performance are critical.
The 2013289-2 series of memory connectors is a part of the 2013289 family of Inline Module Sockets from Amphenol. This particular series is a low-profile board-to-board connector designed for up to 500V of operating voltage and offers up to 28 contacts per linear row with male and female styles available. These connectors feature a compact design for high-density applications and are fashioned to meet the latest Automotive Safety Standards.
The 2013289-2 uses a spring-loaded interface which ensures reliable and consistent electrical contact between mating connectors. It is equipped with a two-piece, floating contact carrier which provides a gas-tight, high-contact force interface. The 2013289-2 also features aluminum alloy shells for superior heat dissipation which offers greater durability in high-temperature applications.
The specialized locking mechanism incorporated into this series ensures secure mating retention. It uses a unique overmolded “V-beam” design that ensures optimal protection from accidental detachment and vibration. The series also features WFLA (Wire-Form Lock Assembly) for secure mating against vibration. The WFLA can support up to 20lbs. of retention force and dissipate heat away from the lock.
The 2013289-2 has a unique construction designed for ease of assembly. It uses one-piece contact bodies for easy assembly and removal. Its insulation body is made of thermoplastic UL 94V-0 rated material which makes it ideal for high-temperature applications.
In addition, the series is specially designed for high-frequency applications. Its contact construction uses 50µ inch gold plating to provide reliable performance, superior corrosion and wear resistance. The contact design also ensures less contact resistance in high-frequency applications, making them the perfect choice for use in high-speed data and telecommunication system applications.
The 2013289-2 series of Inline Module Sockets is a high-performance, low-cost solution for memory applications. With its high-density design and superior performance, it is the perfect choice for designers requiring a reliable, secure and cost-effective connector solution.
The specific data is subject to PDF, and the above content is for reference
Part Number | Manufacturer | Price | Quantity | Description |
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