2013289-2 Connectors, Interconnects

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Memory Connectors, or Inline Module Sockets, are designed to provide high-density connector solutions for today\'s demanding memory applications. They offer multiple configurations including board-to-board, card-to-card and chip-to-board connections. These high-density connectors provide optimal performance for system designs where space optimization and dynamic memory performance are critical.

The 2013289-2 series of memory connectors is a part of the 2013289 family of Inline Module Sockets from Amphenol. This particular series is a low-profile board-to-board connector designed for up to 500V of operating voltage and offers up to 28 contacts per linear row with male and female styles available. These connectors feature a compact design for high-density applications and are fashioned to meet the latest Automotive Safety Standards.

The 2013289-2 uses a spring-loaded interface which ensures reliable and consistent electrical contact between mating connectors. It is equipped with a two-piece, floating contact carrier which provides a gas-tight, high-contact force interface. The 2013289-2 also features aluminum alloy shells for superior heat dissipation which offers greater durability in high-temperature applications.

The specialized locking mechanism incorporated into this series ensures secure mating retention. It uses a unique overmolded “V-beam” design that ensures optimal protection from accidental detachment and vibration. The series also features WFLA (Wire-Form Lock Assembly) for secure mating against vibration. The WFLA can support up to 20lbs. of retention force and dissipate heat away from the lock.

The 2013289-2 has a unique construction designed for ease of assembly. It uses one-piece contact bodies for easy assembly and removal. Its insulation body is made of thermoplastic UL 94V-0 rated material which makes it ideal for high-temperature applications.

In addition, the series is specially designed for high-frequency applications. Its contact construction uses 50µ inch gold plating to provide reliable performance, superior corrosion and wear resistance. The contact design also ensures less contact resistance in high-frequency applications, making them the perfect choice for use in high-speed data and telecommunication system applications.

The 2013289-2 series of Inline Module Sockets is a high-performance, low-cost solution for memory applications. With its high-density design and superior performance, it is the perfect choice for designers requiring a reliable, secure and cost-effective connector solution.

The specific data is subject to PDF, and the above content is for reference