2013290-1 Connectors, Interconnects |
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Allicdata Part #: | A121581-ND |
Manufacturer Part#: |
2013290-1 |
Price: | $ 5.59 |
Product Category: | Connectors, Interconnects |
Manufacturer: | TE Connectivity AMP Connectors |
Short Description: | CONN SKT SODIMM 204POS SMD REV |
More Detail: | 204 Position SODIMM DDR3 SDRAM Socket Surface Moun... |
DataSheet: | 2013290-1 Datasheet/PDF |
Quantity: | 2017 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
1 +: | $ 5.08410 |
10 +: | $ 4.86486 |
25 +: | $ 4.42260 |
50 +: | $ 4.20147 |
100 +: | $ 4.09091 |
250 +: | $ 3.64866 |
500 +: | $ 3.42752 |
1000 +: | $ 3.02948 |
Specifications
Series: | -- |
Packaging: | Tray |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Connector Style: | SODIMM |
Number of Positions: | 204 |
Memory Type: | DDR3 SDRAM |
Standards: | -- |
Mounting Type: | Surface Mount, 25° Angle |
Features: | Board Guide, Latches |
Mounting Feature: | Reverse |
Contact Finish: | Gold |
Contact Finish Thickness: | Flash |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Memory Connectors - Inline Module Sockets
The 2013290-1 inline module socket is part of the family of memory connectors designed for memory storage applications. Additionally, it is used in electronic test and measurement systems and is available in a wide variety of form factors.The 2013290-1 socket is a single piece, two piece, or board-level module socket, manufactured by 3M Electrical Connectors. It is designed to provide optimal performance and flexibility for attaching memory modules to printed circuit boards. This product has a wide temperature range, improved strength-to-weight ratio, and a low interface resistance. The module socket is highly reliable in a variety of application needs, including aerospace, gaming, medical/biotech, semiconductor, and renewable energy.The 2013290-1 socket is available in several standard sizes, and can be easily configured for specific application requirements. It is also available with a variety of contact designs, including solder contact, quick attach SMT terminals, and a low-resistance top and bottom contact surface. These features allow for a high level of mechanical, electrical, and environmental compatibility, allowing customers to use this module socket in a variety of applications.The working principle of the 2013290-1 module socket is based on its design. For example, the single contact element is designed to minimize contact resistance and provide an efficient electrical current path for memory modules. The dual contact elements are designed to provide uniform contact pressure to hold the memory modules in place. Additionally, the board-level socket is designed to prevent electrical shorts and provide a secure mechanical mounting for the memory module.The 2013290-1 module socket can be used in several applications, including the ability to hold memory devices in place in the system. The module socket is also appropriate for attaching additional memory modules to motherboards, helping to expand the system’s memory capacity. Additionally, the 2013290-1 module socket is useful for creating custom memory configurations in high-performance systems. Finally, the socket can also be used in applications that require a low profile module socket to fit into tight spaces.The 2013290-1 module socket is designed to provide a reliable, efficient, and secure electrical connection for memory modules. The socket\'s design is based on a single piece, two piece, or board-level module socket. It provides a low contact resistance and uniform contact pressure for a secure connection. Additionally, the module socket is available in several form factors and contact designs, allowing for a wide assortment of application needs. The 2013290-1 module socket is an ideal solution for increasing memory capacity, allowing for the creation of custom memory configurations, or providing a low-profile mounting solution.The specific data is subject to PDF, and the above content is for reference
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