2013310-3 Allicdata Electronics

2013310-3 Connectors, Interconnects

Allicdata Part #:

2013310-3-ND

Manufacturer Part#:

2013310-3

Price: $ 4.07
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN SKT SODIMM 204POS SMD
More Detail: 204 Position SODIMM DDR3 SDRAM Socket Surface Moun...
DataSheet: 2013310-3 datasheet2013310-3 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
10000 +: $ 3.70188
Stock 1000Can Ship Immediately
$ 4.07
Specifications
Series: --
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Style: SODIMM
Number of Positions: 204
Memory Type: DDR3 SDRAM
Standards: --
Mounting Type: Surface Mount, 25° Angle
Features: Board Guide, Latches
Mounting Feature: Normal, Standard - Top
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Memory connectors are designed to provide a quick and reliable connection for electronic components, such as memory modules or other circuit boards in computers. Inline module sockets from established connector companies such as EVE, Kitron, and Wibo are designed to make the connection process fast and straightforward. In this article we will discuss the application fields and working principles of EVE Inline module sockets.

EVE Inline module sockets provide an excellent solution for applications where space and cost are primary considerations. These sockets are typically used in a variety of consumer products, networking equipment, and industrial applications. EVE Inline module sockets are designed for easy installation of memory components into a system board. The socket is designed to hold a specific type of memory module, such as DDR, Cache, RAM modules, and others.

The EVE inline module sockets use a simple and robust design. The socket is provided with a mono-block base with extensions. The mono-block is provided with a spring-loaded latch which is used to secure the memory module into the socket. The socket also contains a set of 20-pin contacts which are designed to contact the memory module.

The EVE inline module sockets are also provided with a dual-ribbed system for further securement of the memory module. The ribbed elements, which are usually made of metal, will serve to ensure a secure connection between the memory module and the socket. The ribbed elements are also designed to provide EMC shielding.

The contact elements that are used in EVE inline module sockets are designed to provide a reliable and robust connection between the memory module and the socket. They are designed to provide a low-resistance connection between the two components and to ensure a secure and reliable connection. The contact elements are constructed from a combination of metal and plastic materials. The plastic material is used to minimize the contact resistance and reduce the thermal resistance of the connection.

EVE inline module sockets are typically used in a wide range of applications. The most common applications include consumer electronics, medical, automotive, and aerospace applications. This type of socket is also used in wireless applications, such as RFID, WLAN, Bluetooth, and others. Also, due to the compact design of the socket and its capability to accept a wide range of memory modules, EVE inline module sockets are used in a wide range of memory related applications.

In conclusion, the EVE inline module sockets are designed to provide a reliable and robust connection between memory modules and other components. The socket is provided with a robust mono-block base and uses a simple and reliable contact design. The EVE inline module sockets are suitable for a wide range of applications, including consumer electronics, medical, automotive, and aerospace applications. They are also well suited for wireless applications, due to their compact design and ability to accept a wide range of memory modules.

The specific data is subject to PDF, and the above content is for reference

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