207596-3

ARINC (Aeronautical Radio, Incorporated) backplane connectors are devices that connect multiple modules of electronics together. For example, an ARINC backplane connector can be used to link together modules with different electronic components such as amplifiers, digital converters, video processors, or encoders. The ARINC 207596-3 is a multi-pin backplane connector manufactured by ARINC Incorporated.

The main purpose of the ARINC 207596-3 is to provide a reliable, flexible and cost-effective option for connecting two or more sub-assemblies for aviation applications. It provides a robust and reliable connection that supports multiple layers of interconnectivity, including power, signal, video, and data. Its specific feature set makes it ideal for use in aerospace, avionics, instrumentation, and data communications.

The ARINC 207596-3 backplane connector is based on the ARINC 600 family of connectors. It is designed to provide a very high density backplane interconnect. The connector has two rows of 18 pins and two columns of 10 pins that can be used for power, signal, video, and data signals. Each pin is clearly marked and identified with a specific purpose in order to ensure a reliable system-level connection.

The ARINC 207596-3 backplane connector is also equipped with a mechanical single-point locking system. This feature helps to keep the connector securely connected to other components. It should be noted that this connector\'s pins are not symmetrically placed, which helps to prevent incorrect connections.

The working principle of the ARINC 207596-3 is quite simple. The connectors are designed to accept a wide range of input signals, such as power, video, or data. The signals are then routed through a series of pins to the destination device. The connector is designed to create a very reliable and robust connection between the different modules.

The ARINC 207596-3 backplane connector is an extremely versatile and reliable solution for connecting multiple modules. It is a highly reliable, low-cost and space-saving solution that can provide a robust and flexible connection for various applications. Its high density backplane interconnects provide optimal solutions for applications that require multiple layers of interconnectivity, including power, signal, video, and data.