2283B Allicdata Electronics
Allicdata Part #:

2283B-ND

Manufacturer Part#:

2283B

Price: $ 9.47
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: BOARD LEVEL HEAT SINK
More Detail: Heat Sink BGA Aluminum 1.0W @ 40°C Board Level
DataSheet: 2283B datasheet2283B Datasheet/PDF
Quantity: 1000
5000 +: $ 8.52467
Stock 1000Can Ship Immediately
$ 9.47
Specifications
Series: --
Part Status: Active
Type: Board Level
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Shape: Square, Fins
Length: 0.655" (16.64mm)
Width: 0.655" (16.64mm)
Diameter: --
Height Off Base (Height of Fin): 0.265" (6.73mm)
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 17.50°C/W @ 300 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are devices designed to efficiently dissipate heat away from sensitive components in a wide array of applications. Their popularity has grown steadily due to improved thermal engineering techniques and advancements in cooling solutions that can provide consistent and lasting cooling performance. The 22B heat sink is one of the latest designs in this growing field. It offers improved performance compared to other heat sinks with its unique design and a range of features that make it suitable for a variety of applications.

The 22B heat sink is primarily used for cooling semiconductor components such as transistors, integrated circuits and power transducers. It is also suitable for applications such as cooling motors, and where space is constrained such as medical devices and electronic control systems. Its particular design makes it unique amongst heat sinks, as it is able to dissipate heat in two directions, making it more efficient than traditional heat sinks that only dissipate heat in one direction.

The operation of the 22B heat sink is based on the principle of convection, in which heat is dissipated from the device to the surrounding environment. This process is achieved through a series of fins which are connected to the heat sink body, and allow air to flow through them. As the air passes across the fins, it collects the heat and passes it outside of the device, where it can be dissipated in a safe and efficient manner.

The design of the heat sink is also a key factor in its effectiveness. The fins on the 22B are designed to evenly distribute heat across the surface of the device, ensuring that all components are cooled to the same temperature. This reduces the risk of any component overheating, which can cause serious damage. Additionally, the fins provide a large area for the air to flow over, resulting in a more powerful cooling system.

The construction of the 22B heat sink is also designed to minimize the noise generated by the fan. This is achieved through an optimized design which maximizes airflow, resulting in a quieter fan that still effectively cools the device. Additionally, the construction of the fins ensures that they remain rigid and stable during operation, which further reduces noise output.

The 22Bheat sink is an ideal choice for many applications, due to its many features and benefits. It is capable of dissipating heat in two directions, making it more efficient than traditional heat sinks, and its unique design ensures that all components are cooled to the same temperature. Additionally, its optimized design minimizes noise output, so that it can be used in applications where noise is a concern. The 22B heat sink is an excellent choice for cooling a variety of components and for those applications where space is at a premium.

The specific data is subject to PDF, and the above content is for reference

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