26922 Allicdata Electronics

26922 HEATSINK FOR TE0720 SPRINGLOADED

Allicdata Part #:

1686-1002-ND

Manufacturer Part#:

26922

Price: $ 14.84
Product Category:

Fans, Thermal Management

Manufacturer: Trenz Electronic GmbH
Short Description: HEATSINK FOR TE0720 SPRINGLOADED
More Detail: Heat Sink TE0720 Top Mount
DataSheet: 26922 datasheet26922 Datasheet/PDF
Quantity: 167
1 +: $ 13.49460
Stock 167Can Ship Immediately
$ 14.84
Specifications
Series: TE0720
Part Status: Active
Type: Top Mount
Package Cooled: TE0720
Attachment Method: Bolt On
Shape: Rectangular, Fins
Length: --
Width: --
Diameter: --
Height Off Base (Height of Fin): --
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: --
Material Finish: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

Heat sinks are cooling systems that dissipate heat generated by computers, electrical systems, and other devices. To effectively dissipate heat, a heat sink needs to be installed to the heat-generating component. 26922 is a thermal heat sink, designed to dissipate heat in high temperature areas and applications. This heat sink not only has a large amounts of surface area, but also the ability to attach to a variety of components.

Overview

The 26922 thermal heat sink is a high-quality, reliable, and durable heat dissipation solution. Its construction is precision machined from aluminum in a special process that ensures a perfect fit. Its impressive surface area comprises of several fins, providing maximum cooling performance. Additionally, this product is also designed to reduce noise and save energy. The 26922 thermal heat sink also features a variety of options as far as mounting and attachment. The heat-sink can be either clamped, through-hole, or pneumatic mounted. This flexibility enables it to be attached to a variety of components and systems. In addition to these features, the 26922 thermal heat sink has a wide range of design and customization options.

Application Field

The 26922 thermal heat sink is suitable for a variety of applications where effective thermal management is a priority. Examples include telecom, power electronics, lighting, medical, military, and automotive industries. This product is perfect for applications with high temperatures, as it provides optimal thermal performance. In addition to these applications, this heat-sink is also suitable for industrial automation systems, computers, and communication systems. The 26922 thermal heat-sink is also suitable for cooling high performance components like heatsinks, coolers, and LED lamps. Additionally, this product is great for thermally intensive applications such as aerospace, defense, and renewable energy applications. This product is extremely flexible and can be adapted to a range of applications, ensuring effective thermal management.

Working Principle

The 26922 thermal heat sink operates on the principle of conduction thermal dissipation. Heat is generated by the component or system and transferred to the heat sink via conduction. This ensures that the component does not overheat and reduces the risk of damage. The surface area of the heat sink provides the area necessary for efficient cooling. Once the heat has been transferred to the heat sink, it is dissipated by the airflow. This causes the heat to transfer from the heat sink to the surrounding atmosphere. The effectiveness of the heat transfer also depends on the thermal conductivity of the material. The 26922 thermal heat sink has a high thermal conductivity, making it an efficient thermal dissipation system.

Conclusion

The 26922 thermal heat sink is an efficient heat dissipation solution for high-temperature applications. Its construction enables it to be installed to a variety of components and systems, while its versatility ensures that it can be used in a wide range of applications. Additionally, its flawless design ensures optimal thermal performance, making it the perfect choice for thermal management.

The specific data is subject to PDF, and the above content is for reference

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