4088AH51H01783 RF/IF and RFID |
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Allicdata Part #: | 4088AH51H01783-ND |
Manufacturer Part#: |
4088AH51H01783 |
Price: | $ 2.00 |
Product Category: | RF/IF and RFID |
Manufacturer: | Laird Technologies EMI |
Short Description: | GK NICU PTAFG PU V0 REC |
More Detail: | N/A |
DataSheet: | 4088AH51H01783 Datasheet/PDF |
Quantity: | 1000 |
110 +: | $ 1.81199 |
Series: | -- |
Part Status: | Active |
Type: | Fabric Over Foam |
Shape: | Rectangle |
Width: | 0.220" (5.60mm) |
Length: | 17.830" (452.88mm) |
Height: | 0.051" (1.30mm) |
Material: | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) |
Plating: | -- |
Plating - Thickness: | -- |
Attachment Method: | -- |
Operating Temperature: | -- |
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RFI and EMI - Contacts, Fingerstock and Gaskets
In modern telecommunications, the application of 4088AH51H01783 contact materials is only one small but integral part of a much larger picture. In order to achieve the most effective mitigation against Radio Frequency Interference (RFI) and electromagnetic interference (EMI), it is essential to have an understanding of the technical details pertaining to signal filtering, grounding, smart contact materials and materials for use in protecting antenna systems and other broadcasting equipment. Similarly, it is also important to gain an understanding of the various types of fingerstock and gasket materials that are used to facilitate the sealing of mechanical components.
The 4088AH51H01783 contact materials are a type of contact material typically used in electronic components, such as switches, connectors, and contacts. These contact materials are designed to provide low resistance, corrosion resistance, and excellent electrical and mechanical properties. The contact materials are typically made from a variety of metal alloys, such as silver, nickel, cooper, gold, and beryllium. They are also available in various sizes, shapes, and surface finishes, depending on the specific application.
When it comes to RFI and EMI mitigation, the 4088AH51H01783 contact materials are used in conjunction with other means, such as fingerstock and gaskets, to provide the highest level of protection and electrical signal filtering. The contact materials are used to seal and encase key electrical switches and signal wires while fingerstock and gasket materials are utilized to create an air tight and tamper-proof connection.
The most common type of fingerstock materials used in RFI and EMI mitigation are composed of either conductive alloys or non-conductive polymers. Conductive alloys, such as silver, cooper, or gold, are used to ensure that current remains within a closed circuit and does not leak out into another circuit. Meanwhile, non-conductive polymers, such as rubber and foam, are used as insulation to further prevent the leakage of an electrical signal to outside circuits.
Gaskets, on the other hand, are mainly used to limit the transmission of electrical signals to the outside environment. By having these gasket materials in place, any interferences from outside sources, such as vibration and noise, are reduced significantly. Additionally, gaskets provide strain relief for low voltage electrical components and help maintain a watertight seal.
In conclusion, it\'s important to understand how the application of 4088AH51H01783 contact materials, together with the utilization of fingerstock and gasket materials, allows for effective mitigation against RFI and EMI. While these materials provide the required levels of protection and electrical signal filtering, they must be handled and installed correctly to ensure maximum performance and longevity. Without these key pieces of technology, communication systems and their components would be vulnerable to interference and damage.
The specific data is subject to PDF, and the above content is for reference
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