4105AB22102600

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RFI and EMI contacts, fingerstock and gaskets are used to protect electronic equipment from electrical disturbances, including Radio Frequency Interference (RFI) and Electromagnetic Interference (EMI). The 4105AB22102600 technology offers the same level of protection, but with significantly increased performance. This application field and working principle will be discussed here.

Application Field

4105AB22102600 is a new technology that essentially absorbs and eliminates EMI and RFI disturbances. It is best suited for applications such as power supplies, consumer electronics, lighting, industrial automation, data centers, and medical devices, and also provides superior protection in highly sensitive electronic systems. Unlike other technologies, its unique design also provides significant improvements in thermal transfer and thermal management, with no extra burden on the system design.

Working Principle

The 4105AB22102600 technology is based on a three-dimensional conductive material with a conductive structure inside. This three-dimensional conductive material is a combination of metal and non-metal materials. The metal part enables fast conduction, a smooth transition in the direction of current flow, and a well-designed electrical performance, while the non-metal part acts as a shield, preventing the penetration of RFI and EMI signals. The different characteristics of these materials supplement each other, forming an effective thermal and electrical shielding barrier, resulting in superior performance.

In addition, the technology also uses a unique high-frequency contact, which is designed to provide a low-resistance, low-inductance contact profile for high-frequency data and power transmission. The contact also features a bellows-style connection design, which helps maintain contact stability by minimizing resistance change due to stresses or temperature variations.

The 4105AB22102600 technology’s optimal thermal transfer and thermal management features make it suitable for use in applications where maximum heat dissipation is required. To ensure maximum performance, the technology also incorporates a unique heat dissipation system, with a thermal pad that provides increased thermal transfer and thermal management within the system.

Conclusion

4105AB22102600 technology is a unique solution for eliminating EMI and RFI disturbances, providing superior protection in highly sensitive electronic systems. It utilizes a three-dimensional conductive material in combination with a high-frequency contact and a thermal pad to ensure optimal thermal management and maximum heat dissipation. This technology is best suited for applications such as power supplies, consumer electronics, lighting, industrial automation, data centers, and medical devices.

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