411615B02500 Allicdata Electronics
Allicdata Part #:

CR511-ND

Manufacturer Part#:

411615B02500

Price: $ 0.00
Product Category:

Fans, Thermal Management

Manufacturer: Comair Rotron
Short Description: HEATSINK EXTRUDED 25X41.6X38.1MM
More Detail: Heat Sink TO-218, TO-220, TO-247 Aluminum 10.0W @ ...
DataSheet: 411615B02500 datasheet411615B02500 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Part Status: Obsolete
Type: Board Level, Vertical
Package Cooled: TO-218, TO-220, TO-247
Attachment Method: Bolt On and PC Pin
Shape: Rectangular, Fins
Length: 1.500" (38.10mm)
Width: 1.650" (41.91mm)
Diameter: --
Height Off Base (Height of Fin): 1.000" (25.40mm)
Power Dissipation @ Temperature Rise: 10.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 1.50°C/W @ 700 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is critical for reliable and efficient operation in electronic devices and components. Heat sinks are commonly used in many industries for cooling of electronic components and systems. 411615B02500 are specialized heat sinks designed specifically for use in high-power semiconductors.

The 411615B02500 has a thermal performance rating of 150W at 50 degrees Celsius. It has been designed for use in extreme environments with temperatures up to 100 degrees Celsius. The base material used for 411615B02500 is aluminum alloy 6181, which is highly conductive and highly corrosion resistant. The fins of the heat sink are formed from aluminum alloy 6181 as well, and are designed in a modular pattern with excellent heat dissipation.

The 411615B02500 has five distinct application fields. It is primarily used in power electronic applications such as automotive ignition and lighting systems. It can also be used in optical transmission systems and personal computer-related systems. Additionally, it is used in air-cooled systems, such as telecommunications and power supplies. Finally, the heat sink is ideal for use in variable speed motors and medical equipment.

The 411615B02500 works with the thermal management of devices and electrical systems by transferring the heat generated by the components to another location or ambient air. The heat sink is designed to provide maximum thermal conduction without increasing the temperature of the system. This heat sink also acts as an impedance, suppressing electromagnetic interference and thus protecting against data loss or corruption.

In order to ensure optimal operation, the 411615B02500 needs to be properly installed. This involves fixing it on to the source of heat and then creating a path for heat dissipation. This process requires well-designed and well-maintained thermal solutions which match the cooling requirements of the system. The heat sink should be installed on to a surface with the highest possible thermal conductivity, such as metal or dense plastic, in order to maximize thermal performance.

The 411615B02500 is a specialized, efficient, and reliable thermal solution for high-power semiconductors and electronic devices. It provides optimal thermal performance and protection from data loss or corruption caused by electromagnetic interference. With proper installation and thermal management, the 411615B02500 can provide reliable and efficient operation.

The specific data is subject to PDF, and the above content is for reference

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