4202PA51G01800 Allicdata Electronics

4202PA51G01800 RF/IF and RFID

Allicdata Part #:

903-1267-ND

Manufacturer Part#:

4202PA51G01800

Price: $ 3.02
Product Category:

RF/IF and RFID

Manufacturer: Laird Technologies EMI
Short Description: GSKT FAB/FOAM 6.4X457.2MM DSHAPE
More Detail: N/A
DataSheet: 4202PA51G01800 datasheet4202PA51G01800 Datasheet/PDF
Quantity: 1000
91 +: $ 2.74022
Stock 1000Can Ship Immediately
$ 3.02
Specifications
Series: --
Part Status: Active
Type: Fabric Over Foam
Shape: D-Shape
Width: 0.252" (6.40mm)
Length: 18.000" (457.20mm)
Height: 0.118" (3.00mm)
Material: --
Plating: --
Plating - Thickness: --
Attachment Method: Adhesive
Operating Temperature: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

RF interference (RFI), electromagnetic interference (EMI), and radiofrequency interference (RFI) are terms used to describe an unwanted transmission of electromagnetic energy, that has the potential to disrupt communication, electronic equipment, or other systems. Contacts, Fingerstock and Gaskets are devices used to reduce the affects of RFI and EMI on electronic devices.

The 4202PA51G01800 is a contact specifically designed to reduce RFI and EMI in electronic applications. It is a fingerstock constructed from carbon steel, with an organic epoxy coating. The 4202PA51G01800 offers superior performance in both single-shield construction and multi-shield construction.

The 4202PA51G01800 is designed to be used in electronic motor control, automotive, communication and avionics, sensitive electronic equipment, and other applications. Its superior structural design minimizes and reduces the amount of EMI and RFI energy that can leak out of a device, while providing superior electrical contact. Its superior flexibility helps ensure that a device will remain stable under varying conditions, while its superior corrosion resistance helps ensure long-term reliability.

The working principle of the 4202PA51G01800 is based on the concept of bonding metal particles, such as copper and tin, to an organic material, such as epoxy, to form a matrix. These particles are arranged in a specific pattern that minimizes RFI and EMI interference. The pattern helps to prevent the escape of RFI and EMI energy by providing an interface between the electronic device and the environment. This interface also helps to reduce the amount of current that can leak out of the device, reducing the amount of interference.

The 4202PA51G01800 is a reliable and cost-effective solution for reducing RFI and EMI interference in electronic devices. Its superior construction and design helps ensure reliable performance, while its organic coating helps to protect the electronic device from corrosion and other environmental elements. With its wide range of applications, the 4202PA51G01800 is the ideal choice for reducing RFI and EMI interference in any type of electronic system.

The specific data is subject to PDF, and the above content is for reference

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