4202PA51H09600 Allicdata Electronics

4202PA51H09600 RF/IF and RFID

Allicdata Part #:

4202PA51H09600-ND

Manufacturer Part#:

4202PA51H09600

Price: $ 13.19
Product Category:

RF/IF and RFID

Manufacturer: Laird Technologies EMI
Short Description: GK NICU PTAFG PU V0 DSH
More Detail: N/A
DataSheet: 4202PA51H09600 datasheet4202PA51H09600 Datasheet/PDF
Quantity: 1000
17 +: $ 11.98740
Stock 1000Can Ship Immediately
$ 13.19
Specifications
Series: --
Part Status: Active
Type: Fabric Over Foam
Shape: D-Shape
Width: 0.252" (6.40mm)
Length: 96.000" (243.84cm)
Height: 0.118" (3.00mm)
Material: Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
Plating: --
Plating - Thickness: --
Attachment Method: Adhesive
Operating Temperature: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

RFI and EMI are two closely related concepts that are often misunderstood by many of those who work in the electronics industry. They are defined as radio frequency interference (RFI) and electromagnetic interference (EMI). These two concepts are related because they are both forms of radio-frequency energy that can enter the circuitry of a device, and cause unwanted disruptions and interference. But while RFI is caused by external sources, EMI is caused by the device\'s own internal components.

The 4202PA51H09600 is a great example of the application field and working principle of RFI and EMI. This type of contact form is used to reduce RF and EMI leakage and is made of high-strength, high-conductivity materials that will provide exceptional electrically conductive performance. The contact form provides an effective barrier between circuits, and it is also provided with a soldermasked fingerstock for additional RFI and EMI protection.

The fingerstock is a conductive metal material that is commonly used in the manufacture of electronic devices and components. It is used as a solderable coating which can easily be soldered on and added to printed circuit board (PCB) designs and components to reduce RF and EMI radiation. The metal material used is typically copper or silver, which is electrically conductive and able to absorb the RF and EMI. This, in turn, reduces the chances of interference with the circuitry of the device.

Furthermore, the 4202PA51H09600 contact form is also made with a gasket. A gasket is an insulating material, usually made of rubber or cork, which is placed between two components. The gasket helps to provide a physical barrier to RF and EMI radiation, as well as to absorb any vibrations. This helps to reduce interference levels and keep the device running smoothly.

To conclude, the 4202PA51H09600 is a great application field and working principle for RFI and EMI that provides an effective barrier between circuits. The fingerstock and gasket combination helps to reduce interference levels and keep the device operating properly. This is an important factor to consider when working with any type of electronic device, as poor interference levels can lead to device failure or malfunction.

The specific data is subject to PDF, and the above content is for reference

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