421K Allicdata Electronics
Allicdata Part #:

345-1049-ND

Manufacturer Part#:

421K

Price: $ 10.26
Product Category:

Fans, Thermal Management

Manufacturer: Wakefield-Vette
Short Description: HEATSINK POWER NO MNT HOLES BLK
More Detail: Heat Sink TO-3, DO-5, Stud Mount Aluminum 50.0W @ ...
DataSheet: 421K datasheet421K Datasheet/PDF
Quantity: 197
1 +: $ 9.32400
10 +: $ 8.80488
25 +: $ 8.28730
50 +: $ 7.76930
100 +: $ 7.25130
250 +: $ 6.73331
500 +: $ 6.60385
Stock 197Can Ship Immediately
$ 10.26
Specifications
Series: 421
Part Status: Active
Type: Board Level
Package Cooled: TO-3, DO-5, Stud Mount
Attachment Method: Press Fit
Shape: Rectangular, Fins
Length: 3.000" (76.20mm)
Width: 4.750" (120.65mm)
Diameter: --
Height Off Base (Height of Fin): 2.625" (66.67mm)
Power Dissipation @ Temperature Rise: 50.0W @ 58°C
Thermal Resistance @ Forced Air Flow: 0.70°C/W @ 250 LFM
Thermal Resistance @ Natural: 1.16°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The 421K application field and working principle is a notable area of research in the thermal area. A 421K is a relatively new cooling device that has been developed for cooling very hot components such as CPUs and GPUs. It works by using both heat and pressure to dissipate energy.

In general, the 421K works by using two separate elements: an inner shell and an outer shell. The inner shell is a metal or plastic part that is designed to contain and protect the heat generated by the components inside. The outer shell is a larger metal or plastic part that is designed to dissipate the heat. The two shells are usually connected together with a flexible heat pipe.

The inner shell is filled with a low-viscosity, low-pressure fluid and the outer shell is filled with a higher-pressure fluid. When the outer shell is exposed to high temperatures, the two fluids will mix. The increased pressure will cause the fluid to pass through the inner shell and into the outer shell, thus absorbing the heat and transferring it away from the components. The 421K can also be used to absorb excess thermal energy from components, helping them to reduce their temperature.

The working principle of the 421K is based on the phase-shift principle of thermodynamics. In this principle, the material has a certain temperature at which it will “shift” from its normal solid state to a different state. By utilizing this shift, the 421K manages to transfer heat away from the components and into the coolant. This is the same principle that is employed in creating various cooling systems that are used in cooling datacenters, servers, and other devices.

The 421K has also been found to be very reliable and effective at cooling sensitive electronic components. The use of the 421K has made it possible to reduce the temperature of hot components by up to 60%. This makes it ideal for use in situations where components need to be cooled quickly and reliably. The 421K is also relatively silent, making it a perfect fit for applications where sound levels need to be kept to a minimum.

The 421K has become the preferred solution for many applications that require cooling, from datacenters and servers to high-end graphics cards and other sensitive components. The reliability and efficiency of the device makes it well suited for any application that requires cooling of components. The ease of installation and maintenance make it a great choice for busy IT environments.

The specific data is subject to PDF, and the above content is for reference

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