4533EP51K00712 RF/IF and RFID

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RFI and EMI - Contacts, Fingerstock and Gaskets

In today’s digitally connected world, 4533EP51K00712 is becoming increasingly important for electronic manufacturers. As electronic components have become smaller and as more complex circuitry continues to emerge, using the right type of contact materials can make a big difference in product performance and reliability.
A properly designed contact system can help ensure that the maximum amount of power is delivered to the process and the integrity of the signal is maintained in spite of interference.
This section will provide an overview of 4533EP51K00712, including its application field and working principle.

Application Field

The 4533EP51K00712 is designed to optimize contact performance and improve signal integrity for high-speed digital and analog devices. It is suitable for a variety of applications that require high-powered and reliable connections, including:

• Telecommunications
• Computer systems
• Military and aerospace
• Robotics
• Medical imaging
• Industrial machinery

Working Principle

The 4533EP51K00712 is made from durable polymer materials and is designed to improve contact reliability and signal integrity. The contact material consists of two components: a contact fingerstock and a contact gasket. These two components form a conductive shell that helps to minimize crosstalk, minimize EMI, and reduce corrosion.

The fingerstock material is made from a polymer material that is designed to provide a low contact resistance, while also reducing contact bounce and chatter. This material also increases the contact lifespan by minimizing oxidative degradation and reducing the formation of pit corrosion over time.

The contact gasket is made from a non-metallic material that offers an EMI shield to reduce EMI interference. This gasket also minimizes the risk of short-circuiting between components, which is important for high-powered devices.

Conclusion

The 4533EP51K00712 is designed to provide reliable contact performance and reduce the risk of EMI interference in high-speed electronics. This contact material is suitable for a variety of applications, including telecommunications, computer systems, military and aerospace, robotics, medical imaging, and industrial machinery.

The material is made of two components: a contact fingerstock and a contact gasket. The fingerstock is made from a polymer material that offers low contact resistance and reduces contact bounce. The contact gasket is made from a non-metallic material that provides EMI shielding and reduces the risk of short-circuits.

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