4584PA51G01800

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The 4584PA51G01800 is a specifically engineered contact, fingerstock and gasket product designed for use in Radio Frequency Interference (RFI) and Electromagnetic Interference (EMI) applications. The contact is designed to provide a low impedance connection between two components to minimize radiation of electromagnetic energy.

The contact components consist of a sheet of conductive fingerstock mounted in a compressed gasket material that is made of a highly conductive fillers embedded in a light oil medium. The entire assembly is about 0.165" thick, with a width and length that will fit the PCB board in a specified application. The whole assembly is die-cut and inspected for free of burrs. The laser cutting ensures accuracy of the contact size as well as being repeatable from lot to lot for high volume applications.

The fingerstock is composed of layers of thin metal foil which are laminated together for extra strength. The metal used is typically beryllium copper, conductive pathogen, silver nickel, or tin. The adhesive between laminations is especially formulated to make sure no contamination occurs between layers of the contact material. In some cases, extra edges can be bent over to reduce distortion of the contact during board insertion.

The contact material is engineered for a tight fit to minimize parasitic capacitance and inductance. It is designed with a special interfacial surface that improves contact quality and performance. The contact’s “memory” ensures that the contact is firmly seated on the board and effectively dissipates the heat generated from a high power BGA.

The contact is designed to function as the shield or ground connection between two components, providing shielding from RFI and EMI. It is an important part of the layout of a circuit, and is used to reduce cross-talk, maintain signal integrity, and reduce board flexing. The contact is designed to absorb energy from passing signals and dissipate this energy as heat.

The material used in the contact is particularly designed to support the high frequency range with a low impedance value. This reduces the chance of interference and noise due to RFI or EMI entering the circuit from outside sources. The contact also prevents interference from being generated from within the circuit.

The 4584PA51G01800 contact provides a very effective method of shielding from RFI or EMI when properly installed. As a general rule, the contact should be installed within one row of the IC or PCB being shielded and on the edge of the board, as close as possible to the IC or component being shielded. The contact should also be placed as close as possible to the base of the board, with the contact layer sandwiched between the board and the component, for the best effect.

The contact is designed to be used in a variety of applications such as high-end servers, personal computers, laptop computers, cell phones, automotive systems, broadcasting equipment and industrial machinery, among others. By providing effective shielding from RFI and EMI, the contact is essential for meeting EMC and EMI certification requirements, as well as preserving the signal integrity of the circuit.

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