Allicdata Part #: | 903-1103-ND |
Manufacturer Part#: |
4584PA51H01800 |
Price: | $ 2.35 |
Product Category: | RF/IF and RFID |
Manufacturer: | Laird Technologies EMI |
Short Description: | GSKT FAB/FOAM 3.8X457.2MM DSHAPE |
More Detail: | N/A |
DataSheet: | 4584PA51H01800 Datasheet/PDF |
Quantity: | 1140 |
1 +: | $ 2.12940 |
10 +: | $ 1.92339 |
25 +: | $ 1.71713 |
100 +: | $ 1.54539 |
250 +: | $ 1.37365 |
500 +: | $ 1.20195 |
1000 +: | $ 0.99590 |
2500 +: | $ 0.92721 |
5000 +: | $ 0.89287 |
Series: | -- |
Part Status: | Active |
Type: | Fabric Over Foam |
Shape: | D-Shape |
Width: | 0.150" (3.80mm) |
Length: | 18.000" (457.20mm) |
Height: | 0.039" (1.00mm) |
Material: | Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) |
Plating: | -- |
Plating - Thickness: | -- |
Attachment Method: | Adhesive |
Operating Temperature: | -- |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
RFI and EMI - Contacts, Fingerstock and Gaskets
The 4584PA51H01800 application field and working principle concern the main types of contacts, fingerstock, and gaskets that are used in Radio Frequency Interference (RFI) and Electromagnetic Interference (EMI) applications. These components are often used in high speed data transmission, electrical power, and signal-conditioned applications, and must be capable of shielding and damping out interference signals while maintaining reliable electrical connections.
Contacts are the essential link between the two electrical parts or components in an RFI or EMI environment. As the name suggests, fingerstock are metal pieces that are shaped like fingers which are used to securely connect one part to the other. Gaskets are made of several materials, such as rubber, copper, brass, or aluminum, and serve as a barrier between the two parts, effectively blocking the flow of electromagnetic waves or electrical current.
Contacts
The 4584PA51H01800 contacts are made of high grade materials, such as gold, silver, and stainless steel, and are designed for high-performance in RFI and EMI applications. The contacts are divided into two categories: metal-to-metal contacts used in wire-to-board and board-to-board connections; and spring-loaded contacts used in solderless power and signal connections. The contacts are designed to provide reliable and secure electrical connection while not impairing the signal transmission and reducing signal crosstalk. They are also able to suppress interference signals or damp out noise caused by the environment.
Fingerstock
The 4584PA51H01800 fingerstock is a metal bracket made of stainless steel, brass, or gold-plated steel. The most common shape is the “U” shape, but there are also angled and rectangular shapes available. The fingerstock is spring-loaded and is designed to securely connect two parts together, while providing a strong electrical and EMI shield between the two parts. The fingerstock also serves as an aid in aligning components, and can help reduce the amount of crosstalk or interference.
Gaskets
The 4584PA51H01800 gaskets are made of several materials, such as rubber, copper, brass, or aluminum. These gaskets serve as a barrier between two components and block the flow of electromagnetic waves or electrical current. In addition, they are designed to create a seal between two harsh environments, which helps reduce crosstalk or interference. In some cases, the gaskets are designed with foam or cloth insert, which helps to reduce vibration and eliminate any potential noise that could travel between the two components.
The 4584PA51H01800 application field and working principle describes the main types of contacts, fingerstock, and gaskets used in RFI and EMI environments. The contacts are specifically designed for high performance, the fingerstock helps ensure secure and reliable connections, and the gaskets provide a barrier and can reduce interference. Together, these components are designed help ensure that electronic devices or components can function reliably and safely in challenging RFI and EMI environments.
The specific data is subject to PDF, and the above content is for reference
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