4633PA51G01800 RF/IF and RFID

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

RF interference (RFI) and electromagnetic interference (EMI) contacts, fingerstocks and gaskets are designed to provide electrical insulation that shields electronics devices from electromagnetic radiation. The 4633PA51G01800 model of RFI and EMI contact, fingerstock and gasket is specifically designed for use with a power module system. The model is designed to provide shielding performance of greater than 50dB throughout the frequency range of 30MHz to 3GHz, and to reduce or eliminate any mechanical noise when utilizing digital circuits.

Application Field of the 4633PA51G01800

The 4633PA51G01800 RFI and EMI contact, fingerstock and gasket model is primarily designed to be used in power module systems. Examples of these systems include, but are not limited to, electric vehicles, power supplies, inverters, power converters, microinverters, and electric drivetrain systems. The contacts are also suitable for any devices that require EMI shielding and require a high level of electrical insulation.

The 4633PA51G01800 model is particularly suitable for use in electric vehicle powertrain systems, as it is designed to provide shielding performance of greater than 50dB throughout the frequency range of 30MHz to 3GHz. This model is also designed to provide a high level of electrical insulation, ensuring that any EMI radiation is effectively shielded.

The 4633PA51G01800 model is also suitable for use in other applications requiring a high degree of electrical insulation that requires EMI shielding. Examples of these applications include, but are not limited to, data centers, cellular networks, and other similar applications.

Working Principle of the 4633PA51G01800

The 4633PA51G01800 RFI and EMI contact, fingerstock and gasket model is designed with a copper plated beryllium copper alloy contact that is capable of providing electrical insulation of greater than 90dB throughout the frequency range of 30MHz to 3GHz. This copper plated beryllium copper alloy contact ensures that any electromagnetic radiation emitted from the system is efficiently shielded.

In addition, the 4633PA51G01800 model utilises a high-temperature polyurethane foam insulation material, which is designed to reduce or eliminate any mechanical noise when utilizing digital circuits. This high-temperature foam insulation material is also designed to keep the contact cooler for increased reliability.

In general, the 4633PA51G01800 model works by providing an electrical connection between the system\'s power source and the shielded device. The contact ensures that any EMI radiation emitted by the system is efficiently shielded and the high-temperature foam insulation provides a layer of protection against mechanical noise. This ultimately ensures that the system is operating according to the required specifications.

Conclusion

The 4633PA51G01800 RFI and EMI contact, fingerstock and gasket model is specially designed for use in power module systems. This model is designed to provide shielding performance of greater than 50dB throughout the frequency range of 30MHz to 3GHz, and to reduce or eliminate any mechanical noise when utilizing digital circuits. The model utilises a copper plated beryllium copper alloy contact that provides electrical insulation of greater than 90dB along with a high-temperature polyurethane foam insulation material to ensure that any EMI radiation is efficiently shielded and any mechanical noise is eliminated.

The specific data is subject to PDF, and the above content is for reference