4694PA51H01800

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Radio frequency interference (RFI) and electromagnetic interference (EMI) are both sources of electric fields that interfere with the operation of electronics. The effects of RFI and EMI can be disruptive, causing instability and potentially damaging sensitive electronic components. As such, effective shielding is necessary to reduce or prevent the interference caused by these fields.

Contacts, fingerstock, and gaskets are materials designed to provide insulation or a barrier between electronics and electromagnetic fields (such as those generated by RFI and EMI). They have been developed to increase the level of protection from these fields, provide better shielding, and increase the performance of electronic components.

The 4694PA51H01800 is a fingerstock contact designed to be used in EMI and RFI-sensitive applications, such as automotive electronic control units. It is manufactured from electroplated copper with a Nickel-Molybdenum alloy plating. This additional layer of protection helps to reduce the EMI/RFI susceptibility of the contact.

The working principle of the 4694PA51H01800 is based on the principle of electromagnetic shielding. The nickel-molybdenum alloy plating acts as a barrier to the EMI/RFI, which is then further contained and absorbed by the copper housing, effectively shielding the contact. The 4694PA51H01800 material is also designed to withstand vibration as well as thermal shock, making it a highly reliable contact.

The 4694PA51H01800 contacts are designed to provide low contact resistance with proper retention force, allowing for effective shielding and reliable and consistent performance. The contacts are designed with a head height of 0.5mm, a contact width of 0.6mm and a contact length of 1.7mm. They are also designed to work with a range of substrate material such as copper carriers, heat sinks, and PC boards.

The 4694PA51H01800 contact offers many advantages over standard fingerstock materials. The additional layer of nickel-molybdenum plating helps to reduce EMI/RFI susceptibility and provide better shielding, while the copper housing helps to absorb the EMI/RFI. The design of the contact also provides superior retention force and low contact resistance.

The 4694PA51H01800 contact is highly reliable, as it is designed with a robust construction and designed to withstand vibration as well as thermal shock. The contact also works with a range of substrate materials, making it a versatile contact.

The 4694PA51H01800 is a fingerstock contact designed for use in EMI and RFI-sensitive applications, and is manufactured from electroplated copper with a Nickel-Molybdenum alloy plating. The contact is designed to reduce EMI/RFI susceptibility and provide improved shielding over standard fingerstock material, as well as superior retention force and low contact resistance. The contact is also highly reliable, and is designed to withstand vibration as well as thermal shock. Additionally, the contact works with a range of substrate materials, making it a versatile contact. As such, it is an ideal contact for use in RFI and EMI sensitive applications.

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