4795PA51G01800 RF/IF and RFID

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Being part of RFI and EMI - Contact, Fingerstock and Gasket categories, 47 95PA51G01800 is a metallic product with multiple uses within the electromagnetic compatibility market. It is supplied in a 1.25" thick sheet, with 0.06" x0.25" stock of tin-plated layers, making it ideal for the production of a variety of contact gasket designs.

In particular, the 47 95PA51G01800 can be employed as a board-level shielding material, as it allows the impregnation of an adhesive to thermoset onto the board, such as a two-part epoxy preform. In this fashion, it can be used to improve the shielding performance of electronic packages and equipment, through effective shielding of the system from signals originating from nearby EMI sources, and vice versa.

The main working principle of this material is the use of a mesh fabrication technology. It consists of multiple layers of metal foil, separated by a plastic adhesive matrix, which together form a very thin profile. Yet, the metal foil’s width is small enough to allow for a high amount of flexibility. Additionally, this assembly is then punched out with what are known as “fingerstock” dies. This punch creates what are known as “fringes”, which must be the defining characteristic of 47 95PA51G01800.

The principle of operation is then divided into three layers. Firstly, the top layer provides electrical contact to other and adjacent components. Secondly, the adhesive matrix performs a great role in providing the required flexibility and dampening effect. Finally, the unique “fringes”, together with the other layers, provide the required shielding properties.

In general, the 47 95PA51G01800 is well suited for applications such as embedded antenna systems, board level shielding - including RF or microwave filters, low power shields or shields over high frequency board, gaskets or seam seals for enclosure and EMI filters.

In terms of installation, the product is able to cover surfaces using an adhesive, either through roll to roll or diecutting techniques, making it quite suitable for any complex and scattered layout requirements. Additionally, it can be used with other alternative materials for shielding, such as conductive paints or spray-on enclosures.

In summary, the 47 95PA51G01800 is a high performance shield material which offers an effective and reliable way of improving the shielding performance of electronic packages. Its multiple layers of metal-lined foil, residing within an adhesive matrix, are designed to provide electrical contact, flexibility, damping effect, and shielding properties. As such, it is ideal for a wide range of applications ranging from EMI filters to board level shielding and enclosure gaskets.

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