4795PA51H02126 RF/IF and RFID

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Radio Frequency Interference (RFI) and Electromagnetic Interference (EMI) are two types of electro-magnetic signals which can interfere with the proper functioning of electronic components and circuits. Many electronic equipment manufacturers and engineers are concerned with interference from external sources and the prevention of the spread of electromagnetic fields. As such, they frequently use contact materials such as 4795PA51H02126 (contact, fingerstock and gaskets) to introduce shielding and other shielding solutions.

Application Field

4795PA51H02126 contact materials are widely used in aerospace, consumer electronics, automotive and other industrial applications. They are routinely used to provide a low-resistance contact area on printed circuit boards, to provide electrical connection between components, and for shielding. The material is also widely used in the manufacture of EMI shields, RFID (radio-frequency identification) products and general industrial applications.

4795PA51H02126 materials are also highly effective in reducing the impact of EMI from external sources on electronic components, including those used in sophisticated avionics systems. The materials are specifically designed to provide a low level of ohmic contact in order to minimize the transmission of EMI, while still providing the required level of electrical contact.

Working Principle

The main principle behind the working of 4795PA51H02126 contacts is to reduce the transmission of EMI by providing an electrically conductive interface between components and circuits. These materials are effective in providing a low-resistance electrical contact point which effectively reduces the transmission of EMI. The materials are made of a lead-tin (also known as ‘tin-lead’) alloy, which is composed of 96% copper and 4% tin. This material is very conductive, as it has very low resistivity and low contact resistance values.

The material also has excellent shielding characteristics, as well as the capability of dissipating heat. This is due to its high thermal conductivity. The material is also highly resistant to oxidation and corrosion, and can be soldered in place using a standard soldering iron.

When used to provide a low-resistance contact area between components or circuits, the material acts as an effective EMI shield and dramatically reduces the amount of EMI which can penetrate the circuit board. In addition to its EMI shielding capabilities, the material also provides mechanical stability to the contact, which helps to maintain the connection between components or circuits.

Conclusion

The 4795PA51H02126 contact materials are used in a variety of applications to provide a low-resistance electrical interface between components or circuits and to reduce the transmission of EMI. They are composed of 96% copper and 4% tin, which gives them excellent conductive, thermal and corrosion-resistant properties. These materials are also highly effective in providing a low level of ohmic contact, which minimizes EMI transmission, while still providing the required level of electrical contact. As such, they are a great choice for electronic components and RFID products.

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