501403B00000G

Series:	--
Part Status:	Active
Type:	Board Level
Package Cooled:	TO-3
Attachment Method:	Bolt On
Shape:	Rhombus
Length:	1.880" (47.75mm)
Width:	1.400" (35.56mm)
Diameter:	--
Height Off Base (Height of Fin):	0.750" (19.05mm)
Power Dissipation @ Temperature Rise:	4.0W @ 40°C
Thermal Resistance @ Forced Air Flow:	3.00°C/W @ 400 LFM
Thermal Resistance @ Natural:	10.00°C/W
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks
Heat sinks are used for thermal management and control in a variety of applications from consumer electronics to industrial equipment to military systems. Commonly found in commercial, medical, industrial and military applications, they are used to transfer and dissipate waste heat away from sensitive components and devices. The 501403B00000G heat sink is designed for power transistor and module heat dissipation. It has a black anodized aluminum base plate with multiple fin shapes attached.The 501403B00000G heat sink is typically used in applications that require high-power dissipation and excellent thermal performance. These heat sinks are designed to absorb and dissipate heat away from components and sensitive devices, allowing them to remain cooled and to prevent thermal damage. This type of thermal management allows for maximum performance and longevity of components and devices while minimizing the chance of equipment failure.The 501403B00000G heat sink works by transferring heat from the source to its multiple fins. The aluminum base plate has many air channels with an efficient fin design which maximizes the air flow circulating around the fins. The multiple fins increase the surface area which acts as a radiator in order to dissipate the heat absorbed by the base plate. When air flows through each fin, it absorbs the heat energy, and the air carries it away, cooling the component and device.The 501403B00000G heat sink has a low Thermal Resistance (Rth) for high-power dissipation and excellent thermal performance. This type of thermal management is also designed to minimize the Thermal Resistance (Rth), the temperature rise of both the power transistor and module, increasing their lifetime and reliability. Thermal resistance is a direct measure of the heat sinks\' effectiveness at dissipating heat, with the lower the thermal resistance values indicating the lower the heat transfer level. The 501403B00000G series also offers other features such as good mechanical shock and vibration properties, corrosion resistance, firm connection, and robust construction. The heat sink structure also offers high strength and rigidity due to its design. This allows the heat sink to take any adverse mechanical load without any distortion. The installed components can stay in their original position without any movement.The 501403B00000G heat sinks provide a reliable solution for power transistor and module heat dissipation. Its low thermal resistance, efficient fin design, and robust construction make it an attractive choice for engineers and designers. The heat sink is also easily configured and installed, providing a convenient solution for thermal management and control.

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