Allicdata Part #: | HS110-ND |
Manufacturer Part#: |
501603B00000G |
Price: | $ 0.90 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | HEAT SINK TO-3 1.25" COMPACT |
More Detail: | Heat Sink TO-3 Aluminum 4.0W @ 30°C Board Level |
DataSheet: | 501603B00000G Datasheet/PDF |
Quantity: | 1856 |
1 +: | $ 0.81900 |
10 +: | $ 0.77553 |
25 +: | $ 0.75524 |
50 +: | $ 0.73483 |
100 +: | $ 0.69401 |
250 +: | $ 0.65318 |
500 +: | $ 0.61236 |
1000 +: | $ 0.57154 |
5000 +: | $ 0.55112 |
Series: | -- |
Part Status: | Active |
Type: | Board Level |
Package Cooled: | TO-3 |
Attachment Method: | Bolt On |
Shape: | Rhombus |
Length: | 1.880" (47.75mm) |
Width: | 1.400" (35.56mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.250" (31.75mm) |
Power Dissipation @ Temperature Rise: | 4.0W @ 30°C |
Thermal Resistance @ Forced Air Flow: | 3.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 7.80°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal – Heat Sinks are an important part of any electronic application. Heat sinks deal with the absorption and dissipation of heat generated by the electronic components. To facilitate these processes, multiple types of heat sinks are used in a range of applications, such as high-power semiconductor devices, flat-panel displays, computer systems, and many more. One such device is the 501603B00000G.
The 501603B00000G is a single-stage, silver-plated copper heat sink. It is designed for use in applications that require efficient heat dissipation. The device is mainly applied in the field of thermal management, as it can easily dissipate large amounts of heat generated by high-power components.
The 501603B00000G consists of a combination of two components: the heat sink base and heat sink fins. The heat sink base is made of high-grade copper, which is then silver-plated to maximise heat transfer efficiency. An advanced air tunnel-like design is applied to optimize the airflow for efficient cooling. Sitting atop this base is a matrix of metal fins arranged in a honeycomb pattern. These fins provide an expansive area for heat transfer through convection.
In terms of installation, this device is quite simple to install. It requires either fasteners or a frame-mounted clip. Once secured in place, the device is ready for operation. Users can also opt to apply a thermal pad to the bottom side of the heatsink to increase its overall efficiency.
The 501603B00000G device can be used for a range of applications and operates in a very straightforward manner. By maximizing the surface area of the heat sink to dissipate more heat, it works by materializing the air around it with a fan. This heated air is routed away, usually to the heatsink’s exterior. As a result, the heat generated inside the device gets effectively dissipated.
The 501603B00000G is just one example of how effective a device can be when it comes to heat transmission. For any application that requires efficient heat dissipation, it is a wise choice and can certainly prove beneficial to the user.
The specific data is subject to PDF, and the above content is for reference
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501646-3200 | Molex Connec... | 1.59 $ | 2728 | CONN RECEPT 32POS 2MM32 P... |
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