501603B00000G Allicdata Electronics
Allicdata Part #:

HS110-ND

Manufacturer Part#:

501603B00000G

Price: $ 0.90
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: HEAT SINK TO-3 1.25" COMPACT
More Detail: Heat Sink TO-3 Aluminum 4.0W @ 30°C Board Level
DataSheet: 501603B00000G datasheet501603B00000G Datasheet/PDF
Quantity: 1856
1 +: $ 0.81900
10 +: $ 0.77553
25 +: $ 0.75524
50 +: $ 0.73483
100 +: $ 0.69401
250 +: $ 0.65318
500 +: $ 0.61236
1000 +: $ 0.57154
5000 +: $ 0.55112
Stock 1856Can Ship Immediately
$ 0.9
Specifications
Series: --
Part Status: Active
Type: Board Level
Package Cooled: TO-3
Attachment Method: Bolt On
Shape: Rhombus
Length: 1.880" (47.75mm)
Width: 1.400" (35.56mm)
Diameter: --
Height Off Base (Height of Fin): 1.250" (31.75mm)
Power Dissipation @ Temperature Rise: 4.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.80°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal – Heat Sinks are an important part of any electronic application. Heat sinks deal with the absorption and dissipation of heat generated by the electronic components. To facilitate these processes, multiple types of heat sinks are used in a range of applications, such as high-power semiconductor devices, flat-panel displays, computer systems, and many more. One such device is the 501603B00000G.

The 501603B00000G is a single-stage, silver-plated copper heat sink. It is designed for use in applications that require efficient heat dissipation. The device is mainly applied in the field of thermal management, as it can easily dissipate large amounts of heat generated by high-power components.

The 501603B00000G consists of a combination of two components: the heat sink base and heat sink fins. The heat sink base is made of high-grade copper, which is then silver-plated to maximise heat transfer efficiency. An advanced air tunnel-like design is applied to optimize the airflow for efficient cooling. Sitting atop this base is a matrix of metal fins arranged in a honeycomb pattern. These fins provide an expansive area for heat transfer through convection.

In terms of installation, this device is quite simple to install. It requires either fasteners or a frame-mounted clip. Once secured in place, the device is ready for operation. Users can also opt to apply a thermal pad to the bottom side of the heatsink to increase its overall efficiency.

The 501603B00000G device can be used for a range of applications and operates in a very straightforward manner. By maximizing the surface area of the heat sink to dissipate more heat, it works by materializing the air around it with a fan. This heated air is routed away, usually to the heatsink’s exterior. As a result, the heat generated inside the device gets effectively dissipated.

The 501603B00000G is just one example of how effective a device can be when it comes to heat transmission. For any application that requires efficient heat dissipation, it is a wise choice and can certainly prove beneficial to the user.

The specific data is subject to PDF, and the above content is for reference

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