50294-1150H Allicdata Electronics
Allicdata Part #:

50294-1150H-ND

Manufacturer Part#:

50294-1150H

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: 3 ROW R/A RECEPTACLE SOLDER
More Detail: N/A
DataSheet: 50294-1150H datasheet50294-1150H Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: 50
Voltage Rating: --
Operating Temperature: --
Material Flammability Rating: UL94 V-0
Current Rating: --
Color: --
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold
Features: Mating Guide
Contact Layout, Typical: --
Termination: Solder
Mounting Type: Through Hole, Right Angle
Series: HPC™
Number of Rows: 3
Pitch: 0.100" (2.54mm)
Number of Positions Loaded: All
Number of Positions: 150
Connector Style: High Density (HDC, HDI, HPC)
Connector Type: Receptacle, Female Sockets
Connector Usage: Daughtercard
Moisture Sensitivity Level (MSL): --
Part Status: Obsolete
Lead Free Status / RoHS Status: --
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane connectors, such as 50294-1150H, are used for high-speed data transmission, board-level interconnects and system-level backplane designs. They are normally found in aerospace, communications systems, networking, medical and high-density applications. Backplanes of the 50294-1150H type are specialized due to their enhanced features which enable them to provide improved signal integrity, such as greater insertion loss, crosstalk, return loss and impedance control, and stack height.

The working principle of the 50294-1150H connector is based on the principal of electrical pass-through, which is utilized to provide connections between two different circuits. This method is often used in applications such as cable routing, multipoint connections and isolation of high-frequency signals. In a 50294-1150H connector, signal pins are routed through the middle of the connector, thereby providing improved signal integrity and ensuring that the data is able to flow from the source through the connector to the destination.

The 50294-1150H connector utilizes a unique contact arrangement called a mezzanine contact system, which enables signals to be routed from one board to the next. Mezzanine contacts are used to bridge the gap between printed circuit boards, allowing signals to pass through one board to another. This is accomplished by inserting pins into the holes on either side of the connector, which are then connected to the contacts on the other board.

The 50294-1150H connector also utilizes a stack height of 1.2", which is shorter than other backplane connectors, allowing for more boards to be stacked in a single system. Additionally, the 50294-1150H provides improved jackscrew security, which ensures that the connection between the two boards is secure and reliable.

The 50294-1150H connector is designed to provide high-performance and reliable signal transmission. It is suitable for harsh environments and is compliant with MIL-DTL-38999 standards. In addition, it is also designed for superior mechanical stability and power over Ethernet (PoE) capability. The 50294-1150H also has excellent EMI performance and complies with EMC standards, which ensures that it is protected against interference and ensures that data is transmitted correctly and securely.

The 50294-1150H connector is a specialized backplane connector designed to provide high-speed data transmission, board-level interconnects and system-level backplane designs. It utilizes a mezzanine contact system, a stack height of 1.2", and improved jackscrew security to ensure reliable connections, and is suitable for harsh environments and meets MIL-DTL-38999 and EMC standards. As a result, it is an excellent choice for applications such as aerospace, communications systems, networking, medical and high-density applications.

The specific data is subject to PDF, and the above content is for reference

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