50295-1076HLF Allicdata Electronics
Allicdata Part #:

50295-1076HLF-ND

Manufacturer Part#:

50295-1076HLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN RECEPT 4 ROW RA SOLDER
More Detail: N/A
DataSheet: 50295-1076HLF datasheet50295-1076HLF Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
0 +: $ 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: 19
Voltage Rating: --
Operating Temperature: --
Material Flammability Rating: UL94 V-0
Current Rating: --
Color: --
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold
Features: Mating Guide
Contact Layout, Typical: --
Termination: Solder
Mounting Type: Through Hole, Right Angle
Series: HPC™
Number of Rows: 4
Pitch: 0.100" (2.54mm)
Number of Positions Loaded: All
Number of Positions: 76
Connector Style: High Density (HDC, HDI, HPC)
Connector Type: Receptacle, Female Sockets
Connector Usage: Daughtercard
Moisture Sensitivity Level (MSL): --
Part Status: Preliminary
Lead Free Status / RoHS Status: --
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

50295-1076HLF Application Field and Working Principle

The 50295-1076HLF is a specialized backplane connector designed to be used in specific applications. It is a high-reliability, low-maintenance connector with exceptional performance characteristics and is often used for mission-critical applications.

This connector has several key features that make it ideal for a variety of different applications. It has an integrated locking mechanism that ensures a strong, secure connection that is resistant to vibration, shock, and electromagnetic interference. The housing is made from durable, lightweight aluminum alloy and is designed to reduce the weight of the connector. Its internal contact system is designed to provide reliable signal integrity and this connector is compliant with multiple international standards.

The 50295-1076HLF is ideal for applications where durability, performance, and reliability are paramount. It has a low insertion force and a high extraction force, which makes it suitable for applications that require frequent mating and unmating. This makes it ideal for applications subject to vibration or shock. In addition, the 50295-1076HLF is designed to provide reliable signal transmission in high-speed data transmission applications and is capable of transmitting data up to 10 Gb/s, which makes it suitable for applications that require high throughput.

The 50295-1076HLF also has a self-terminating design which eliminates any need for tinning. This makes the connector easy to install, maintain, and upgrade. In addition, it has an active latch that reduces the overall size of the connector and eliminates the need for a separate mounting bracket. This helps to reduce the overall size of the system, making the 50295-1076HLF ideal for space-constrained applications.

The 50295-1076HLF is a specialized backplane connector that is designed for specific applications. It has a series of features that make it suitable for a range of mission-critical applications. Its integrated locking mechanism ensures a secure and reliable connection that is resistant to vibration, shock, and electromagnetic interference. Its low insertion force and high extraction force make it suitable for applications subject to vibration or shock. In addition, its self-terminating design eliminates the need for tinning, making it easy to install, maintain, and upgrade.

The 50295-1076HLF is designed to provide reliable signal transmission up to 10 Gb/s, making it an ideal choice for applications that require high throughput. Its active latch also helps to reduce the overall size of the system, making it suitable for space-constrained applications. In addition, the 50295-1076HLF is compliant with multiple international standards, providing assurance of compatibility and performance.

The specific data is subject to PDF, and the above content is for reference

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