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Series: |
-- |
Part Status: |
Active |
Type: |
Board Level |
Package Cooled: |
TO-220 |
Attachment Method: |
Bolt On |
Shape: |
Rectangular, Fins |
Length: |
0.700" (17.78mm) |
Width: |
1.250" (31.75mm) |
Diameter: |
-- |
Height Off Base (Height of Fin): |
0.375" (9.52mm) |
Power Dissipation @ Temperature Rise: |
1.0W @ 20°C |
Thermal Resistance @ Forced Air Flow: |
6.00°C/W @ 600 LFM |
Thermal Resistance @ Natural: |
20.00°C/W |
Material: |
Aluminum |
Material Finish: |
Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are components that dissipate energy by transferring heat from the device to the environment. They are widely used in electronic and mechanical engineering. In applications requiring higher temperatures, they are used to keep components from overheating and to keep other parts of the system from burning.The 506902B00000G is a thermal heat sink that is designed to dissipate heat more efficiently than standard heat sinks. It features a combination of a custom-designed fin structure, along with a special heat-conducting material. This combination allows it to transfer heat from the heat source more quickly and effectively, allowing the components to stay cooler and run more reliably. The 506902B00000G is made of anodized aluminum, and features a fin-style design with vertical and horizontal fins. This allows the heat to be dissipated evenly across the entire face of the heat sink. The material used for the heat-conducting material is a proprietary compound that is designed to maximise thermal conductivity. This material is formed into a uniform grid-like pattern, allowing more heat to be transferred across it more quickly and efficiently. In addition to this, the material also helps reduce thermal air gaps, which can reduce the effective heat transfer rate of the heat sink.In terms of application fields, the 506902B00000G is widely used in the cooling of electronics, such as computers, servers, and other consumer electronic devices. The combination of its efficient cooling properties and wide temperature range makes it suitable for any application requiring the efficient dissipation of heat. The working principle of the 506902B00000G is fairly straightforward. The heat-conducting material is positioned between two layers of aluminum or other metal, which acts to both draw heat away from the heat source and to spread it evenly across the heat sink before dissipating it into the atmosphere. The specially designed fin structure then helps to further dissipate the heat by increasing the surface area of the heat sink.Overall, the 506902B00000G is an effective and efficient heat sink that is suitable for a wide variety of applications. Its combination of efficient heat transfer and wide temperature range makes it an ideal choice for applications in which rapid and reliable heat dissipation is required.
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