507002B05300G Allicdata Electronics
Allicdata Part #:

507002B05300G-ND

Manufacturer Part#:

507002B05300G

Price: $ 0.75
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: BOARD LEVEL HEAT SINK
More Detail: Heat Sink TO-220 Aluminum 2.0W @ 40°C Board Level,...
DataSheet: 507002B05300G datasheet507002B05300G Datasheet/PDF
Quantity: 1000
8000 +: $ 0.67275
Stock 1000Can Ship Immediately
$ 0.75
Specifications
Series: --
Part Status: Active
Type: Board Level, Vertical
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Shape: Rectangular, Fins
Length: 0.700" (17.78mm)
Width: 1.750" (44.45mm)
Diameter: --
Height Off Base (Height of Fin): 0.375" (9.52mm)
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 15.60°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat sinks are vital for proper cooling of any electronic device. They are used to dissipate heat away from the device, using convection or conduction. The 507002B05300G is one type of thermal heat sink available on the market. In this article, we will explore the 507002B05300G\'s application field and working principle.

The 507002B05300G is a high-performance heat sink typically used for working in environments with very high temperatures. It is constructed with two metal panels, providing excellent thermal conductivity and a flat, low-profile design. The two panels are joined together with bolts and gaskets, allowing for secure and air-tight construction. The heat sink is designed to be used in locations that are prone to temperature buildup, such as in automotive, aerospace, and industrial applications.

The 507002B05300G is designed to provide excellent air flow in high-heat areas. The two panels provide a great surface area for air to flow around, while the low-profile design keeps air from flowing out of the sides. The design also ensures that heat is efficiently dissipated away from the device. The unique design of the 507002B05300G also allows for easy installation and maintenance.

The 507002B05300G\'s working principle is based on the laws of thermodynamics. Heat is generated by the device and transferred to the metal panels of the heat sink. The panels are designed to be efficient at dissipating the heat away from the device, through conduction. The panels also conduct heat away from the device by convection. As air is drawn through the side panels, it carries away the heat generated by the device. By efficiently transferring heat, the device is able to operate in environments with very high temperatures.

In conclusion, the 507002B05300G is a high-performance thermal heat sink, designed for applications with very high temperatures. Its two metal panels provide excellent thermal conductivity and a flat, low-profile design, ensuring that air is efficiently dissipated away from the device. The unique design also allows for easy installation and maintenance. The working principle of the 507002B05300G is based on the laws of thermodynamics, and its efficient heat transfer ensures that the device operates in high-temperature environments.

The specific data is subject to PDF, and the above content is for reference

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