507222B00000G Allicdata Electronics
Allicdata Part #:

HS114-ND

Manufacturer Part#:

507222B00000G

Price: $ 0.49
Product Category:

Fans, Thermal Management

Manufacturer: Aavid, Thermal Division of Boyd Corporation
Short Description: HEATSINK TO-220 DUAL 10W
More Detail: Heat Sink TO-220 (Dual) Aluminum 8.0W @ 70°C Board...
DataSheet: 507222B00000G datasheet507222B00000G Datasheet/PDF
Quantity: 11536
1 +: $ 0.44730
10 +: $ 0.42840
25 +: $ 0.40698
50 +: $ 0.39627
100 +: $ 0.39092
250 +: $ 0.36414
500 +: $ 0.34272
1000 +: $ 0.31059
5000 +: $ 0.29988
Stock 11536Can Ship Immediately
$ 0.49
Specifications
Series: --
Part Status: Active
Type: Board Level
Package Cooled: TO-220 (Dual)
Attachment Method: Bolt On
Shape: Rectangular, Fins
Length: 1.470" (37.34mm)
Width: 1.750" (44.45mm)
Diameter: --
Height Off Base (Height of Fin): 0.375" (9.52mm)
Power Dissipation @ Temperature Rise: 8.0W @ 70°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.60°C/W
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat SinksWhen it comes to managing and dissipating the heat generated by today’s high powered electronics, higher efficiency components such as the 507222B00000G heat sink are often necessary. Developed for applications in the gaming, gaming PC, laser printer, and telecom industries, the 507222B00000G heat sink\'s notable features and impressive performance have made it one of the most popular thermal solutions on the market.The 507222B00000G is an open-frame, single-conductor heat sink with a large DIN rail lug for easy attachment. It is designed with an extruded aluminum body and copper pin fins, providing excellent thermal conductivity for maximum heat dissipation. The 507222B00000G heat sink is also constructed with vented sides allowing for uninterrupted, single-way air flow, which helps to cool the entire electronic system.Among the many benefits of using the 507222B00000G heat sink is its ease of installation and its extremely low profile design. The 507222B00000G heat sink fits comfortably inside most conventional PC cases and can be easily attached to the motherboard, allowing for minimal disruption of the motherboard during installation. Additionally, the 507222B00000G is constructed with a black powder coated finish for effective corrosion protection and long lasting performance.Typically, a 507222B00000G heat sink will be installed in the processor or the uppermost part of the motherboard, usually adjacent to the memory slots. When properly installed, the 507222B00000G heat sink can dissipate heat from the electronic components and disperse it more efficiently to the exterior, ultimately cooling down the system and reducing the needed ventilation requirements. In addition, the 507222B00000G heat sink also provides for a uniform air flow distribution across the entire system, which contributes to increased stability and performance.The 507222B00000G has also been designed to dissipate the highest level of heat possible, and has even become popular among gamers and PC builders for its ability to keep even the most demanding games running at peak performance. The 507222B00000G heat sink\'s superior construction and innovative design allows for consistent cooling even under the most extreme gaming conditions. With its reliability and performance, the 507222B00000G heat sink has become a trusted and widely used thermal solution for modern gaming and telecom systems.Finally, the 507222B00000G heat sink provides efficient heat dissipation, improved system stability, and a hygienic installation with its black powder coat finish. Its efficient performance makes it suitable for a wide range of thermal management applications, from light gaming to telecom and laser printer systems. For anyone looking for a reliable, efficient, and easy to install heat sink, the 507222B00000G is an excellent choice.

The specific data is subject to PDF, and the above content is for reference

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