Allicdata Part #: | 508600B00000G-ND |
Manufacturer Part#: |
508600B00000G |
Price: | $ 0.52 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Aavid, Thermal Division of Boyd Corporation |
Short Description: | BOARD LEVEL HEAT SINK |
More Detail: | Heat Sink 28-DIP Aluminum 2.5W @ 80°C Top Mount |
DataSheet: | 508600B00000G Datasheet/PDF |
Quantity: | 1000 |
7000 +: | $ 0.46778 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | 28-DIP |
Attachment Method: | Thermal Tape, Adhesive (Not Included) |
Shape: | Rectangular, Fins |
Length: | 1.450" (36.83mm) |
Width: | 0.530" (13.46mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.190" (4.83mm) |
Power Dissipation @ Temperature Rise: | 2.5W @ 80°C |
Thermal Resistance @ Forced Air Flow: | 10.00°C/W @ 700 LFM |
Thermal Resistance @ Natural: | 32.00°C/W |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-heat sinks are integral components of any modern cooling system. They are used to dissipate heat generated by electronic components and maintain their normal operating temperatures. Heat sinks are typically constructed from aluminum, copper or other suitable metal alloys designed to absorb and dissipate heat. One particular type of heat sink, the 508600B00000G Applications Field and Working Principle, is gaining particular popularity, especially in cooling applications where high power components are used in close proximity to each other.
The 508600B00000G Application Field and Working Principle are designed to dissipate heat from a variety of different components. It primarily uses natural convection cooling to absorb and disperse heat from the component. The heat sink has an array of fins radiating away from the center of the sink, creating an efficient air-flow path for the heat to travel away from the components. The fins are constructed with high thermal conductivity to promote rapid heat transfer away from the CPU or other heat-emitting components.
The 508600B00000G Applications Field and Working Principle is effective in a range of applications. It is particularly useful in cases where multiple high power components are in close proximity to each other, such as in gaming rigs, servers and industrial applications. It can also be used as a passive cooling solution for CPU\'s, GPUs, and other high-end components. With its ability to rapidly dissipate heat, this heat sink is a great way to protect costly investments.
Aside from providing an efficient way to cool components, the 508600B00000G Applications Field and Working Principle has a number of other benefits. It is a lightweight heat sink, meaning it can easily fit into tight spaces and is less bulky than other heat sinks. Furthermore, its all-aluminum construction makes it corrosion and oxidation resistant, making it a great choice for long-term use. Additionally, it is relatively inexpensive compared to other heat sink types, making it a viable option for budget-minded computer builders.
The 508600B00000G Application Field and Working Principle is an efficient and cost-effective way to keep components running at safe and optimal temperatures. Its natural convection cooling makes it an ideal solution for high power components that are kept in close proximity. Its lightweight build and corrosion-resistant construction also ensure the heat sink will provide long-term reliable cooling performance. With its great value and reliable cooling characteristics, the 508600B00000G Applications Field and Working Principle is a great choice for anyone looking for a reliable and cost-effective cooling solution.
The specific data is subject to PDF, and the above content is for reference
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