508700B00000G

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

A thermal-heat sink is an integral part of any electronic system. It is typically installed on the exterior of an electronic device to help dissipate heat generated from internal components. The 508700B00000G heat sink is a device designed to dissipate heat from electronic components and systems. It is a potted device, meaning it is filled with a special compound such as silicone to aid in the heat transfer process. This heat sink also features two mounting holes for installation.

The 508700B00000G thermal-heat sink uses a combination of airflow and thermal conduction to dissipate heat. Airflow is facilitated by the fan, which is usually located at the top of the heat sink. This fan blows air over the heat dissipating fins, which then move the heat away from the component and towards the outside of the system. Thermal conduction is facilitated by the heat sink base, which is also known as the cold plate. This cold plate is made of a combination of metals such as copper and aluminum, both of which are excellent conductors of heat, and is designed to transfer heat from the component to the air. The heat sink base is also typically coated with a thermal compound to help improve the transfer process.

The 508700B00000G thermal-heat sink is designed to accommodate a wide range of components and systems. It can be used to cool components such as CPUs, GPUs, memory chips, power supplies, and even complete systems. Its maximum operating temperature is rated at 110 degrees Celsius, and it can handle thermal loads up to 50 watts. Its compact and lightweight design makes it suitable for a variety of applications, including desktops, notebooks, embedded systems, industrial control systems, and many others. In addition, the 508700B00000G is extremely efficient, and is one of the most cost-effective thermal-heat sink solutions on the market.

In conclusion, the 508700B00000G thermal-heat sink is an excellent choice for dissipating heat from electronic components and systems. Its combination of airflow and thermal conduction make it a highly efficient and cost-effective solution in a wide range of applications. Its small size and lightweight design make it well suited for a variety of systems, while its maximum operating temperature and thermal load rating make it suitable for even the most thermally demanding applications.

The specific data is subject to PDF, and the above content is for reference