51940-190LF

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Backplane connectors are used to connect the motherboards of electronic devices to safely transfer data and power. The 51940-190LF is a special type of connector that is commonly used in medium to high-density applications. It is designed to safely transmit signals in both directions while minimizing crosstalk.

The 51940-190LF is a right angle receptacle and plug with extended support. It is specifically designed for backplane applications with high race track density. It uses 2 rows of 40 contacts and has an operating temperature range from -55°C to + 105°C. It is designed to meet 6 Gb/s data transfer speeds and is compliant with SATA specifications.

Each 51940-190LF contact is designed for 7.8μm pitch and has a nominal current-carrying capacity of 4.5A. It also has a retention force of 260 N, an insertion force of 10-20 N and a contact resistance of 10 mΩ max. It is an optimized contact system that provides extra-low cross-talk, which is a major concern in high-speed applications.

The 51940-190LF is designed to be used in backplane applications in networking, storage and telecommunication industries. It is often used in communication and video streaming related applications, providing superior performance and reliability. The connector is designed for a variety of applications including bus systems, backplanes, computers, peripherals, satellite systems, industrial machinery, and instrumentation.

The 51940-190LF connector works by connecting two surfaces together using a box and pin connection. This type of connection provides a low-resistance contact surface for signals to travel. The box is the receptacle or plug and the pins are a combination of metal contacts that extend from the box. When the two surfaces are connected, the metal pins slide into holes in the box and create an electrical connection. This allows the signal to travel freely and with low interference.

The 51940-190LF connector is designed to be robust and reliable. It is designed to provide a low-resistance contact system that minimizes crosstalk and is optimized for high-speed applications. It is also designed to withstand harsh environmental conditions, making it ideal for use in a wide variety of applications. It is an ideal solution for high-density backplane connectivity and can be used to provide superior performance and reliability in applications where signal integrity is a major concern.

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